Ziptronix licenses direct bond technology for mobile handsets

The company recently announced that a new collaboration with a customer has demonstrated strong potential for significant cost savings in 3D memory applications, by replacing standard die-stacking methods with Ziptronix DBI wafer-stacking technology. By licensing the technology for a high-volume handset application, the company extends its technology’s cost-saving and efficiency features across multiple supply chains.

“Device manufacturers recognize the value of this technology for a growing range of applications beyond image sensors,” said Daniel Donabedian, CEO of Ziptronix. “We are in licensing discussions with companies around the world for a variety of applications, including next-generation 3D memory stacking and advanced imagers that target true 3D IC integration.”

Donabedian said those discussions support the company’s strategy of pursuing significant adoption of its 3D integration technology across many platforms to bring the benefits of smaller pitch, increased functionality, increased density and scalability, along with lower-cost manufacturing, for future generations of 3D integrated devices. Ziptronix also continues to target licenses in the image sensor market.

Ziptronix

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