TTi is stocking Panasonic’s a new CSP MOSFET featuring Power Mount CSP Packaging (PMCP) which comes with a unique pad design and drain clip technology that enables thermal dissipation to be improved by 5% in an 80% smaller footprint than conventional solutions.
The Series achieves higher power efficiency at the same time as reducing power consumption of the system by using cell technology and wafer thinning fabrication – its silicon now has a 110nm fine trench cell which gives 47% lower RDS(on) over the same sized conventional chip.
Panasonic”s Power CSP MOSFETS are halogen free, have lead-free solder bumps and are RoHS and AEC-Q101 qualified. Two versions are currently available FJ3P02100L and FJ3P02100L. Package sizes are FJ3P02100L: 2.0 x 2.0 x 0.33mm and FK3P02110L: 1.8 x 1.6 x 0.33mm.
Suitable applications include portable gaming devices, hand sets, audio players; smaller medical devices such as hearing aids and blood glucose monitors; IT applications such as servers, routers and adapters; and meters and IC cards.