CIE Components in Electronics
Toshiba Electronics Europe (TEE) has launched the industry’s thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel (MP) imaging for next-generation, ultra-thin smartphones and tablet devices. The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry’s lowest profile at just 4.7 mm.
In order to achieve a high-resolution CMOS image sensors requires a larger optical size for corresponding lenses which results in a thicker camera module and a bulkier mobile device. The conventional method for lowering the camera module height uses only optical lens design, which becomes problematic because resolution drops around the corners of the image area. The TCM9930MD resolves this drop in resolution with the use of an image pre-processing LSI (companion) chip that processes distortion correction and performs image resolution reconstruction.
In addition, the TCM9930MD achieves a low profile by using a flip-chip structure for the image sensor. Toshiba opted to use flip chip packaging because it allows for a large number of interconnects, with shorter distances than wire, which greatly reduces assembling area and package height.
Samples of the new module will be available in May 2013, with mass production scheduled for the end of the year.
