The high-performance system for three-dimensional solder paste inspection SPI-Line 3D celebrates its birthday. In the course of that, GOEPEL electronics offers its customers a special highlight: the inline inspection system now allows highest inspection reliability in measuring solder paste at a very attractive price.
Particularly with regard to inspection speed and detection accuracy, the SPI-Line 3D is technical top class. The 3D camera head allows precise three-dimensional measurement of printed solder paste for the quality assessment of shape, area, volume and planarity. With up to 180 frames per second and high-precision fringe projection technique, a reliable and quick inspection is guaranteed.
The system software SPI-Pilot with touchscreen interface offers efficient and easy programming: test programs can be created in less than 10 minutes. In addition, an offline programming station and a module for SPC evaluation (Statistical Process Control) is available.