The GOEPEL electronics deal of the year – safe and well-priced solder paste inspection

The high-performance system for three-dimensional solder paste inspection SPI-Line 3D celebrates its birthday. In the course of that, GOEPEL electronics offers its customers a special highlight: the inline inspection system now allows highest inspection reliability in measuring solder paste at a very attractive price.

Particularly with regard to inspection speed and detection accuracy, the SPI-Line 3D is technical top class. The 3D camera head allows precise three-dimensional measurement of printed solder paste for the quality assessment of shape, area, volume and planarity. With up to 180 frames per second and high-precision fringe projection technique, a reliable and quick inspection is guaranteed.

The system software SPI-Pilot with touchscreen interface offers efficient and easy programming: test programs can be created in less than 10 minutes. In addition, an offline programming station and a module for SPC evaluation (Statistical Process Control) is available.


Check Also

New Universal 19” rack shelves added to METCASE’s rack accessories range

New universal cantilever shelves from METCASE enable electronics equipment without built-in 19” fittings to be …