Sundance Multiprocessor Technology, a developer of scalable and modular computing modules for embedded solutions, has launched the SMT166 dual-FPGA platform for R&D into the use of large FPGAs for high-performance reconfigurable computing and large-scale embedded systems applications as well as system-on-chip (SoC) simulation.
Sundance has also announced that the SMT166 has been chosen as the prototyping platform for the European Union’s FP7 FlexTiles 3D SoC project, placing it at the heart of leading research into self-adaptive, high-performance computing.
Headed by Thales Research & Technology, The EU FP7 FlexTiles project is focused on leveraging multicore technology to develop energy-efficient, high-performance compute systems and is intended to define and develop a programmable, heterogeneous, many-core 3D SoC architecture. Sundance’s SMT166 will initially be used to develop, validate and verify the tools to create the FlexTiles 3D SoC. Subsequently, users will be able to utilise the SMT166 as an R&D platform to prototype products based on the FlexTiles 3D SoC.
The SMT166, which can be integrated into a standard 19 inch rack, is designed around two Xilinx Virtex-6 FPGAs. Each FPGA is responsible for routing data to and from half the Sundance Local Bus (SLB) connections on the board. In addition, parallel and serial connections are available for inter-FPGA communications. The SMT166 supports up to four SLB mezzanine modules with a wide range of low-cost options available from Sundance such as a multi-ADC system with 16x channels of 14-bit, 250MHz ADC inputs; an octal channel SDR platform; or a complete MIMO 8 x 8 RF transceiver setup. In addition, the SMT166 supports Sundance’s 12-core DSP module which provides over 10,000 MIPS of fixed point DSP processing power. An optional interface to FMC modules allows users to select from a growing range of add-on modules to suit a wide variety of applications. Each FPGA on the SMT166 is coupled with two banks of DDR3 memory and also supports an identical set of peripheral interfaces, including Gigabit Ethernet, dual SATA 3.1, one lane PCIe Cable, four lane PCIe Cable and RS232. A single USB 2.0 interface facilitates FPGA programming during development phases.
“The FP7 FlexTiles project will truly exercise the capabilities of our SMT166 FPGA as a development engine,” said Flemming Christensen, Managing Director of Sundance Multiprocessor Technology. “However, as a powerful FPGA environment that effectively integrates two identical FPGA boards into one, it is also ideally suited to a wide variety of other applications such as large-scale embedded systems and high-performance reconfigurable computing, especially those designed with fault-tolerance in mind.”