STMicroelectronics has unveiled the first three chips in its new family supporting the DOCSIS 3.0 cable-modem specification. Since first demonstrating its DOCSIS 3.0 technology in September last year, ST has moved to introduce the 12-channel STiD125 and 16-channel STiD127 for set-top box or headed gateway front-end, and the 16-channel STiD128 for cable modems and data gateways including headed gateway front-end.
These are believed to be the world’s first DOCSIS 3.0 devices providing up to 16 downlink channels, with four uplink channels, enabling data speeds of up to 800Mbps downstream and 108Mbps upstream.
DOCSIS 3.0 provides the framework for home and mobile entertainment to evolve from legacy MPEG to IP video distribution. The extremely high data rates enable set-top boxes and home gateways to deliver video and internet data converged services over a single network and support simultaneous use of multiple connected devices, such as smart televisions, digital video recorders (DVRs), tablets, smartphones and game consoles in the home. With the availability of DOCSIS 3.0, industry research firm IMS has predicted the market for DOCSIS home devices will grow from 32 million units per year in 2012 to more than 49 million by 2015.
ST’s DOCSIS 3.0 technology is associated with a dual-core ARM Cortex-A9 processor to control routing, switching and telephony functions. ST’s DOCSIS 3.0 devices are taking advantage of their association with ST’s advanced set top box devices such as the Orly STiH416 to provide security and media server functions, for services such as pay TV and internet-based services used in next-generation connected-home products.
“The rapid introduction of these devices leverages ST’s proven expertise in this arena, as ST has already shipped tens of millions of first- and second-generation DOCSIS chips,” said Laurent Remont, ST’s Digital Convergence Group Vice President and Unified Platform Division General Manager. “As the first company to demonstrate 16×4-channel DOCSIS 3.0 technology, the speed with which we’re launching our latest family allows operators to deliver more advanced services to multiple connected users throughout the home.”
ST will release Product Development Kits (PDK) for the STiD125, STiD127 and STiD128, targeting the 23×23 BGA package, in Q1 2013.