The MiniSKiiP, SEMITOP and SKiM 4 IGBT modules will now include variants with 3-level topologies.
The baseplate-free SKiM4 module is the most powerful IGBT module in the range, with rated currents of between 200A and 600A. Power levels as high as 250kVA can be achieved without needing to connect several modules in parallel. SKiM4 modules will be available in TNPC (T-Type Neutral Point Clamped) topology for 650V and 1200V and NPC (Neutral Point Clamped) topology for 1200V. The TNPC modules can deliver up to 900VDC and 480VAC, while the NPC variants can push the EU Low Voltage Directive to its limits of 1500VDC and 1000VAC.
For smaller currents, baseplate-free, spring-contact IGBT MiniSKiiP modules are available. These offer solder-free mounting and are intended for rated currents of between 75A and 200A and reverse voltages of 650V, offering powers of up to 85kVA. At 4.9A/cm², the power density is very high compared with competitor products, making this module ideal for use in compact systems. A further advantage of these modules is the easy single-screw connection between module, heat sink and controller board.
The counterpart to the solder-free MiniSKiiP modules is the SEMITOP, an IGBT module that is 12mm high and soldered on to power circuit boards for use in applications with current ratings of 20 –150A. These baseplate-free solder-connection modules will be available in NPC topology and can deliver up to 65kVA. The voltage rating is 600V.
3-level technology was originally intended to be used to control voltages that were greater than the reverse voltage of the semiconductor device. Now the main advantages of this technology relate to the output voltage waveform: instead of the full positive or negative DC link voltage, now half the DC link voltage is available for each side.
With 3-level technology, the output waveform is closer to an ideal sine wave than is the case for conventional 2-level topologies. The biggest advantage of 3-level technology is the lower distortion factor and consequently reduced filtering requirements. This is particularly important in applications where undistorted output voltage and current waveforms are needed, e.g. uninterruptible power supply systems or solar inverter applications.
Semikron manufactures power modules in two different 3-level topologies: NPC (Neutral Point Clamped) and TNPC (T-Type Neutral Point Clamped), both of which have their advantages.
The advantage of NPC technology is that it allows for a higher overall DC link voltage than each individual semiconductor die would be able to block. This enables manufacturers of solar inverters to apply a DC link voltage of up to 1500VDC to the power modules as opposed to the maximum DC link of around 1100VDC in 2-level modules.
In terms of error management, NPC topology is less complex than TNPC, although the same high-quality output voltage waveform is achievable with both topologies. On the other hand, TNPC modules are slightly more powerful than NPC modules, since they use eight rather than ten different semiconductor dice.