CIE Components in Electronics
The new modules will bring the highest density and performance levels to premium enterprise server systems, according to the company. Samsung previously introduced the industry”s first 30nm-class 2GB DDR4 module in December, 2010.
“By launching these new high-density DDR4 modules, Samsung is embracing closer technical cooperation with key CPU and server companies for development of next-generation green IT systems,” said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. “Samsung will also aggressively move to establish the premium memory market for advanced applications including enterprise server systems and maintain the competitive edge for Samsung Green Memory products, while working on providing 20 nanometer (nm) class based DDR4 DRAM in the future.”
Employing new circuit architecture for computing systems, DDR4 technology has the highest performance among memory products available for today”s computing systems, which by next year will reach twice the current 1,600 megabits per second (Mbps) of DDR3 based modules. Also, by processing data far more efficiently at a mere 1.2 volts, Samsung”s DDR4 modules will reduce power consumption by approximately 40 percent compared to its predecessor DDR3 modules operating at 1.35V.
Samsung said that it would keep working on completion of the JEDEC (Joint Electron Device Engineering Council) standardisation of DDR4 technologies and product specifications, which is expected to be accomplished by August.
The company also said it will work closely with its customers including server OEMs, as well as CPU and controller makers, to expand the market base for high-density DDR4 modules, of which it plans to begin volume production next year. It also is set to expand the overall premium memory market with its most advanced 20nm-class based DDR4 DRAM products, which will be available sometime next year at densities up to 32GB.
