CIE Components in Electronics
Samsung Electronics has introduced a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.
“The new 13,26, and 40W, 129 lm/W high performance COB package family is based on our leading class chip and phosphor technology,” said Jaap Schlejen, senior vice president, LEDlighting sales and marketing, Samsung Electronics. “The new COB family has been designed to meet Zhaga specifications, and has a low thermal resistance and superior heat dissipation for high reliability.”
The series – LC013/26/40B,features a 129lm/W light efficacy at 80 CRI (Color Rendering Index) and 5000K CCT (Correlated Color Temperature)and is available in 2700K, 3000K and 4000K versions. By adopting chip-on-board technology that uses metal core PCBs, the new COB family is able to offer improved colour uniformity and light quality, while achieving a high luminous flux of up to 6000lm in a single LED package.
The Samsung COB family will be available in May with further additions to Samsung”s COB package lineup to be made later this year.
