Rutronik enhances power portfolio with solutions from Infineon

Infineon Technologies AG and Rutronik Elektronische Bauelemente GmbH have expanded their existing franchise agreement. Adding to the product range already available in Infineon”s Industrial segment, Rutronik is also now able to supply IGBT, thyristor and diode modules throughout Europe, enabling customers to acquire the full range of these Infineon products from Rutronik.

The Industrial Power Control (IPC) range from Infineon encompasses IGBTs and IGBT Modules, thyristors and diodes in modular and planar forms, as well as driver ICs and boards. This selection of products addresses the full gamut of potential applications in power classes ranging from 0.5 kW to several MW. The target markets and applications are industrial drives, renewable energies, rail-bound vehicles, uninterruptible power supplies, hybrid and electric vehicles, and increasingly also electrically-powered commercial and agricultural vehicles.

A current product highlight in the Infineon IPC range is the EconoDUALTM 3 series, which provides maximum power density within a small footprint. With the Infineon 600 A IGBT4, this series is available with rated voltages of 600 V, 1200V, and 1700 V. The latest member of the series, the FF600R07ME4_B11 with the improved 650 V IGBT4, offers a cut-off voltage that is 50 V higher and excellent short-circuit withstand strength.

The HybridPACK IGBT modules, which have received qualification for automotive use under AECQ101, offer a cost-optimised and compact design with PressFIT connectors and threaded main connectors for easy and secure connection. The product range available for delivery from Rutronik also now includes Infineon’s Econo, and 62mm product ranges. In the high-power segment, Rutronik provides customers with PrimePACK and IHM/IHV modules, with which Infineon has set industrial benchmarks worldwide. Many products are available with Thermal Interface Material (TIM) pre-applied. This enables the significant reduction of contact resistance between the metal contacts of the power semiconductor and heatsink, thereby facilitating heat transfer. This in turn increases the service life and reliability of the modules.

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