Power module offers improved power density, efficiency and thermal performance

Intersil Corporation has announced the ISL8240M, a dual 20A/single 40A step-down power module that, according to the company, sets a new standard for efficiency and power density in infrastructure and embedded computing applications. Capable of delivering up to 100W of output power in a 2.9 cm2 footprint, greater than 90 percent power efficiency, and industry-leading thermal performance, the ISL8240M provides designers with a turnkey DC/DC converter solution for high current applications.

Power systems for communications and computing infrastructure have to support high current loads from increasingly power hungry FPGAs, ASICs, and microprocessors.  To supply these high current circuits, equipment makers often rely on discrete power solutions that are complicated, take up valuable real-estate and may have significant power output limitations. Intersil’s power module family has been developed to reduce design complexity and create headroom in the power system, thereby increasing flexibility while improving efficiency and thermal performance.

The latest addition to Intersil’s complete family of power modules, the ISL8240M is pin-to-pin compatible with the company’s popular ISL8225M 30A power module, expanding the output current to 40A and delivering up to 100W output power. This offers designers a high level of flexibility, enabling a single PCB design across platforms. The ISL8240M is also capable of delivering up to 240A output when six modules in parallel operation are current shared, enabling the industry’s highest total output current.

The ISL8240M leverages Intersil’s patented technology and advanced packaging techniques to deliver greater than 90 percent power efficiency and the best thermal de-rating performance in the industry, enabling the ISL8240M to operate at full power over a wide temperature range. The module also provides over-temperature, over-current and over-voltage protection, further enhancing the robustness and reliability of the solution.

The ISL8240M is a turnkey solution that requires minimal design since only six external passive parts are required.  The ISL8240M fits in a small 17mm x 17mm footprint. Improved thermal performance eliminates the need for heat sinks, further streamlining power supply design and reducing design and manufacturing risk and increasing reliability.

“The demands on power supplies continue to increase, making every efficiency gain and savings in board-space critical in enabling customers to achieve their design objectives,” said Mark Downing, senior vice president of infrastructure and industrial power products at Intersil. “The ISL8240M complements our family of 30A module solutions, giving designers more flexibility while offering all of the power savings and high level of reliability customers have come to expect from our solutions.”

www.intersil.com

 

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