POLYRACK at embedded world 2018: case and system applications for individual requirements

The PanelPC 2-Series is available in different display sizes and user interfaces

The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 27th to March 1st 2018 at the embedded world in Nuremberg (Hall 3, Booth 557). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.

For the embedded market, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions satisfy the protection class IP54 and are available in sizes from 10.1‘‘ to 21.5‘‘ as well as in different materials such as milled aluminium or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realise individual requirements in materials, such as plastics and castings – also in a material combination mix.

EmbedTEC for Small Form Factor (SFF)

Small Form Factor with EmbedTEC: The aluminium table top case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5“), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminium cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automatisation and IoT.

Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish – fine-tuned to the target market.

www.polyrack.com

Hall 3, Booth 557

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