CIE Components in Electronics
Company Fischer Elektronik GmbH & Co. KG extends their extensive product portfolio of thermal contact materials by new phase change thermal conductive materials which provide an alternative to the conventional thermal conductive pastes. The new material types combine the advantages of high thermal performance together with the reliability of phase change materials and with a simple application on the surfaces to be contacted.
The thermal conductive material with the designation FSF 15 P and FSF 20 P is solid in its delivered condition and begins to flow at a phase change temperature between 52 °C and 48 °C each. Hereby microscopic small unevennesses between heat source and a heat sink for example will be compensated. During the moistening air escapes out of the area of the boundary layer, which leads to a significant reduction of the thermal impedance and simultaneously to an optimal heat transfer resistance. The material thicknesses vary from 0,114 mm up to 0,2 mm whereby the customers can select the particular material thickness contact surfaces depending on the unevenness and roughness. The thermal conductivity of the new designs is within the scope of 1,5 up to 2 W/m×K. For a simple handling (easier installation) in the application both types have a one-sided natural adhesive layer. The basic material of the article FSF 15 P is available as sheet or roll material whereas the FSF 20 P is only available as sheet material in the dimension 300 x 400 mm. Special cuts and contours of the phase change materials will be performed according to customised drawing specifications by means of latest processing machines.
