Panasonic commercialises high thermal conductivity, low transmission loss halogen-free multi-layer circuit board material for wireless base stations

Panasonic Corporation announced that it has commercialised its “high thermal conductivity, low transmission loss halogen-free multi-layer circuit board material (part no. R-5575)” intended for wireless base stations, and will launch mass production in August 2017. The industry”s first halogen-free multi-layer board material for RF power amplifiers is designed to contribute to compact-sizing and stable operation of wireless base stations.

 

In the fifth-generation mobile communication system (‘5G’), currently being developed for implementation in 2020, data communication by a variety of equipment such as smartphones is predicted to require a much greater capacity and higher transmission rates. For 5G communication, demand for ‘small cells’, small base stations that can cover hot spots with high user demand, is expected to expand substantially. RF power amplifier boards used in compact-sized small cells will require a multi-layer structure to achieve further space saving in place of the current mainstream double-sided boards. The industry also requires multi-layer boards that can carry out high-speed communication in high frequency domains while providing low transmission losses as well as low heat generation. Panasonic’s proprietary resin design technology has enabled the industry’s first commercial production of multi-layer circuit board material for RF power amplifiers by providing halogen-free, low transmission loss and high thermal conductivity features that, up to this point, have represented a major technical barrier.

 

Features overview

Panasonic’s new ‘high thermal conductivity, low transmission loss halogen-free multi-layer circuit board material’ has the following features:

  • The industry’s first halogen-free multi-layer circuit board material for RF power amplifiers achieves low transmission losses in the high-frequency range, enabling compact-sizing of wireless base stations
  • Transmission loss at 20 GHz: -20 dB/m
  •  Its high thermal conductivity effectively dissipates heat from heated components used on the power amplifier to provide reliable operation
  • Thermal conductivity: 0.6 W/(m·K) (1.5 times that of the Panasonic’s conventional product)
  • The material protects against deterioration of transmission characteristics in high-temperature environments, thereby contributing to the long-term durability of the base stations
  • Dielectric constant change rate: 1.0 per cent, Dissipation factor change rate: 3.5 per cent (1000 hours at 125°C)
  • Dielectric constant change rate of current products: 3.0 per cent, Dissipation factor change rate of current products: 80 per cent (1000 hours at 125°C)

 

Suitable applications include circuit board for power amplifiers (for wireless base stations, small cell use), etc.

 

www.panasonic.com/global

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