CIE Components in Electronics
Rutronik is stocking Osram Opto Semiconductors’ new multi-chip-LEDs. With a broad bright blue colour range lighting designers now have a free choice of colours for the interior lighting in vehicles. Colour design now covers cluster lighting to an increasing extent, notably in combined instruments such as speedometers and rev counters, in displays, as backlighting for switches and for ambient lighting.
The main feature of the new MultiLED in the standard 3.3 x 3.0 x 1.8mm SMT package is a very broad blue colour range with a wavelength of up to 447nm and high brightness, which allows the production of deep saturated blue tones. This is thanks to the use of three LED chips in red, green and blue (RGB).
At 370mcd the blue is very bright. This brightness is a huge advantage as the human eye perceives the colour blue darker than it really is and the new MultiLED can offset this darker perception.
Other properties of the MultiLED are an integrated ESD protective diode (electrostatic discharge), an improved corrosion resistance and a long market availability, which makes them ideal for use in automobiles.
The three independently controllable LED chips in red, green and blue are available in different brightness groups thanks to finely defined grouping (binning). They can be individually combined to produce a large colour spectrum. All three chip colours are the product of state-of-the-art-technology: Blue and green in UX:3 technology, red in the latest thin-film technology. The light is therefore extracted from the chip with high efficiency, which leads to high luminous intensity: Red comes with 750mcd, blue with 370mcd and green with 1630mcd. In the upper blue wavelength range, a figure of up to 560mcd is achieved at an operating current of 20mA. Luminous intensity in candela (cd) corresponds to luminous flux in lumen (lm) emitted by a light source in a particular solid angle. The typical thermal resistance between the chip and the solder point is 127K/W for blue and green and 96K/W for red.
