Octavo Systems, a leader in System-in-Package (SiP) technology, has announced the most completely integrated 1GHz Arm Cortex-A8 computing platform, the OSD335x C-SiP. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package that is about the size of a standard Lego block. The newest addition to the OSD335x family, the OSD335x C-SiP is a complete system containing the 1GHz Arm Cortex-A8 Sitara AM335x processor from Texas Instruments, up to 1GB of DDR3 RAM, 4KB EEPROM, 2 Power Supplies, up to 16GB of eMMC Non-Volatile Flash Memory, a MEMS Oscillator, and over 100 passive components into its single 27mm X 27mm 400 Ball BGA Package.
“The addition of the eMMC and the Oscillator to the processor, ram, and power supplies, makes the OSD335x C-SiP a complete system. It has everything you need for a powerful Linux computer integrated into a small, easy to use package. All you need to do is add power and a couple of resistors. That is why we call it a Complete System-In-Package,” says Gene Frantz, CTO of Octavo Systems.
Through the integration of OSD335x C-SiP, many of the repetitive and tedious tasks associated with designing a computing system are removed. Things like laying out DDR3 memory interfaces and power sequencing are no longer required. Also, any concerns about Electromagnetic Interference (EMI) caused by the layout of the Oscillator are alleviated. “We estimate that using the OSD335x C-SiP will enable designers to get a system working in half the time required to design a discrete solution,” comments Erik Welsh, application engineering manager of Octavo Systems. “This is time they can spend refining or adding new features to further differentiate their product, or they can simply get to market quicker.”
Besides simplifying the design of an embedded system, the OSD335x C-SiP is also about 50 per cent smaller than an equivalent system built with individual components. This allows designers to shrink their designs, save cost on their PCBs, or add processing power to form factors that weren’t possible before.
Suited for a wide range of applications, the OSD335x C-SiP hits the sweet spot of size and performance for Building Automation, to Industrial Control, to Consumers goods, and is especially popular for IoT. “By integrating Sitara AM335x processors in the Octavo SiPs, Octavo is offering a wide range of performance, communication peripherals and necessary system components into a single package. Including all of these features in one solution that’s also software compatible with other Sitara AM335x processors enables developers to customise their design for a variety of applications,” said Adrian Valenzuela, catalogue processors marketing director at TI.
The OSD335x C-SiP simplifies the process of sourcing components and managing the supply chain. “We have heard from many of our customers how hard it is to get a constant supply of DDR or eMMC. Recently, this has expanded to components like capacitors. Since the OSD335x C-SiP is a complete system, we integrate these components, so our customers no longer need to worry about them. We work closely with our many suppliers to ensure a consistency of supply. The complete integration provided by our SiPs means our customers go from managing over 100 components to just 1,” explains Greg Sheridan, marketing manager for Octavo Systems.
Download the datasheet and request a sample today to begin designing with the OSD335x C-SiP. The OSD335x C-SiP will be available to the general market by the end of the year. The first variation will be built on the AM3358 processor, have 512MB of DDR3 memory, and 4 GB eMMC. It will be available in both industrial and commercial temperature ranges. Greg also adds: “Pricing will be in line with what an equivalent discrete system would cost to build. Our goal is to make our products so attractive from an integration and cost perspective that there is no reason to do a discrete design again.”