The DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20V types optimized for very low forward voltage and three 40V types optimized for very low reverse current. Average forward current ranges between 0.5 and 1.5A.
In addition to offering significant space-saving options, the new Schottky rectifiers are also able to deliver improved power performance due to a huge heatsink at the package bottom. The very low forward voltage of these Schottky diodes reduces power consumption and enables longer battery life in mobile devices. Typical applications include battery charging, display backlighting, switched-mode power supply (SMPS) and DC to DC conversion for small portable equipment. With the 1.5A types, these can be extended to larger devices such as tablet PCs.
The rectifiers in DFN1608D-2 offer unique side pads, which are tin-plated to protect against oxidation, thereby always allowing side solderability. Unlike other leadless solutions where the soldered contacts remain hidden under the package, the side pads help avoid package tilting on the PCB, making it even flatter and maximizing stack density. The ability to solder the package at the side also enables easy visual inspection of the contact. By eliminating the need to inspect the solder contacts with expensive and complex x-ray equipment, the DFN1608D-2 makes the manufacturing process more cost-effective.
Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors, said: “These devices are a real breakthrough in terms of both miniaturization and current density for mobile device designers, giving them functionality options not previously available at this size. Tailored to the needs of ultra-thin applications such as smartphones, we have created the flattest leadless plastic package on the market for 1A and above, with performance parameters found only in devices more than four times larger in size today. This portfolio is another great example of innovative, customer-driven design from NXP.”