In a move intended to help developers jumpstart their product designs, Texas Instruments (TI) has introduced the OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications. The EVM enables quick, easy evaluation and benchmarking for applications demanding high-performance processing and graphics at low power, including human machine interface (HMI), portable data terminals (PDT), digital signage and medical monitoring end equipment.
Based on the dual-1.5GHz ARM Cortex-A15 MPCore, the OMAP5432 EVM has the performance to enable applications run faster. Designed as a cost-effective tool to prototype software, evaluate applications and benchmark designs it gives customers easy access to key interfaces such as Ethernet, USB 3.0, USB 2.0, HDMI, audio I/O and SATA, as well as expansion ports for multiple display and camera options.
It hosts power management and thermal management frameworks, which enable fanless operation across a wide variety of applications. The tool is also equipped with a customized, companion power management integrated circuit (PMIC), the TWL6040 audio codec.
“Our OMAP5432 EVM allows customers to quickly evaluate their applications on a device that has the multimedia and graphics expected from the OMAP platform and the processing power needed for industrial applications,” said Dennis Rauschmayer, marketing manager, OMAP products, TI. “TI’s ecosystem of modules based on the OMAP 5 architecture and design partners help industrial customers move quickly from evaluation to production reducing development cost and speeding time to market.”
To further accelerate evaluation, TI provides customers with key high-level operating systems and real-time operating systems options such as Android, Green Hills Software, Linux and QNX, which are available for download.
After customers prototype and benchmark their designs using the OMAP5432 EVM, they can choose from multiple OMAP543x processor-based modules available through TI’s hardware partners to speed product development. These are available through leading system-on-module (SoM) and single board computer (SBC) vendors, including: Embedded++ (EPP-Pico-OMAP5430 module), Phytec (phyCORE-OMAP5430 SoM module), SECO (µQ7-OMAP5 module) and Variscite (VAR-SOM-OM54 module).
In addition, TI’s integrated design house (IDH) partners and TI Design Network software members are available to customize hardware designs to meet customer needs or provide software services from component level optimizations to system integration and application development.