New die mounting technology eliminates ‘dark spots’; produces clear, defined, precise beam
June 2013…OMC, the pioneer in optoelectronics – LED lighting, backlighting and industrial fibre optic transmission components – has introduced its ClearSource™ range of solid-state emitters that use a new die bonding technique to connect the LED chip electronically to the leadframe, eliminating ‘dark spots’ and improving beam precision.
Standard LED optical sensors use a top-mounting wire bond to connect the LED chip to the anode or cathode. The bond wire obstructs the light output, giving rise to dark spots and patches in the beam which makes precise sensing and detection more difficult. In the new ClearSource series, the wire is bonded to the side of the chip, leaving the output beam unobstructed. This produces a very well-defined light beam which enables high-accuracy sensing and detection. For even greater precision measurements that require near-parallel light emission, lenses can be incorporated. Additionally, this die-bond configuration reduces capacitive effects within the diode, enhancing switching speed and reliability.
Comments OMC’s commercial director, William Heath: “Our new ClearSource emitters also benefit from LED technology’s inherent high reliability and long lifetime. The devices have a low sensitivity to ESD, and are suitable for a wide range of applications including encoders, linear positioning, line and edge sensing, medical equipment, fibre optic systems, machine vision, optical switching, distance and range finding.”
Devices are available with standard apertures for 650nm and 850nm LEDs with ball-type narrow beam, flat, dome, or drip encapsulation lensing options.
For more information, please visit www.omc-uk.com