New 30V PowerTrench MOSFET offers enhanced power density while needing less board space

Using Fairchild’s PowerTrench technology, the FDMC8010 is suited for use in applications where the lowest RDS(ON) is required in small spaces such as high performance DC-DC buck converters, Point of Load (POL), high efficiency load switch and low side switching, voltage regulator modules (VRM), and ORing functions. By using the FDMC8010, designers can move from a 5mm x 6mm to a 3.3mm x 3.3mm package, saving 66 percent of the MOSFET footprint area.

In isolated 1/16th brick DC-DC converter applications, the Power 33 MOSFET’s max RDS(ON) of only 1.3mΩ max, is 25 percent less than the competitive solution in this footprint. Additionally, the device reduces conduction losses thereby improving thermal efficiency by up to 25 percent.

The addition of these new PowerTrench devices is intended to enhance Fairchild’s low-voltage MOSFET offering, and is now part of a comprehensive portfolio of PowerTrench MOSFETs.

Fairchild Semiconductor

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