NXP Semiconductors has introduced the first 10 A, 45 V Schottky barrier rectifiers PMEG45U10EPD and PMEG45A10EPD in the new CFP15 (SOT1289) package. This new Clip FlatPower Package (designed for IF max up to 15 A) has very compact dimensions with a body size of 4.3 mm x 5.8 mm and a height of only 0.8 mm, making it thinner than the pin-compatible PowerDI5 and SMPC (TO-277A) rectifier packages currently available.
This small form factor combined with a high electrical performance makes these devices suitable for next generation smartphone and tablet power adapters. Applications include SMPS / DC-to-DC converters, polarity protection and high-speed switching.
The new rectifiers provide a low forward voltage drop of only 350 mV at 10 A forward current and 85°C junction temperature, thereby reaching increased efficiency levels and high output power ratings needed for fast charging cycles. With high peak current capabilities and a guaranteed breakdown voltage of more than 45 V, the new devices meet the safety demands of up to 15 W chargers with 5 V output voltage.
The PMEG45A10EPD has been optimised for low VF and low IR and boosts a capacitance of only 900pF (typ.) at 1 V. The PMEG45U10EPD has been optimised for lowest VF and has a capacitance rating of 1200pF (typ.) at 1 V.
The CFP15 package design has a solid clip and exposed heat sink to help reduce the package’s thermal resistance and optimise the transfer of heat into the ambient environment; allowing for smaller and thinner charger designs. The front sides of the package leads are also tin-plated and 100% solderable, enabling optical solder inspection.
“With our new CFP15, NXP has developed a package that further enriches the market for compact and high power Schottky rectifiers by offering an even thinner alternative.” said Wolfgang Bindke, product manager diodes, NXP Semiconductors. “Over the course of 2014 and 2015 we will extend the portfolio with further Schottky rectifiers up to 60 V and 15 A . Manufacturers of power adapters as well as automotive suppliers are keen to see smaller and more efficient modules in the coming years.”