CIE Components in Electronics
The Movidius MA1178 Dual ISP and video processor chip integrates into the handset’s existing platforms with auto-calibration and configuration functionality to simplify the design process and reduce the cost of manufacture.
By combining the Toshiba 8 Megapixel EDOF cameras and the Movidius MA1178 will be able to provide a perfect focus matching of stereoscopic images, and offer enhanced 3D picture quality. The solution will provide flexibility for customers looking to implement a symmetric or asymmetric set up of either two 8 Megapixel EDOF cameras or a combination of 8 and 3 Megapixel EDOF cameras.
In an increasingly crowded handset market, manufacturers are looking at high quality 3D imaging capabilities to differentiate their offering from their competitors, providing the end user with the best quality HD 3D experience and enjoyment.
“Movidius’ Myriad 3D solution delivers multimedia features beyond what is offered by any other player in the mobile 3D market at present,” commented Shiro Ando, Vice President, Toshiba Electronics Europe. “Its 3D imaging capabilities complement the high functionality of Toshiba’s EDOF cameras, enabling mobile handset makers to meet consumer demand for a superior 3D mobile experience. Simultaneously, they simplify the manufacturing process by rectifying distortion.”
Commenting Sean Mitchell, CEO of Movidius said “Customers seeking to differentiate their product in the highly competitive handset market will benefit from Movidius’ 3D imaging solution as well as Toshiba’s leading position as an EDOF camera supplier to the mobile phone market.”
Movidius will demonstrate its MA1178 product together with the 3D system solution at the MWC 2012 in Barcelona later this month.
