Molex Incorporated has introduced the Plateau HS Dock+ Connector System for networks that require higher data rates with superior signal integrity to meet the growth in networking and wireless device markets. With a low-mating force, guide features, various offset heights, and the ability to mate in a standard coplanar or inverted coplanar position, this high-speed docking connector system is intended for PCB-blade (option card) to PCB-midplane (host) applications.
Plateau HS Dock+ high-speed docking connectors have an innovative, plated-plastic housing for signal integrity (SI) performance and multiple options for application design flexibility. Molex uses proprietary Plateau Technology (a plated gold housing) to create a high-speed docking connector system for differential and single-ended applications. These fully shielded connectors have a contact design that allows four levels of mating (first-mate/last-break) with a compliant pin for the printed circuit board (PCB) interface.
Plateau HS Dock+ connectors have other performance-improving features such as a smaller press-fit pin on the PCB terminal and shorter terminal stub in mating interface to tighten impedance. In addition, slots and ribs added to the shroud and the plug housing improve insertion and return loss by 50% at 10GHz, while additional ground pins and standoffs on lower housing reduce crosstalk and return loss by 30% at 10GHz.
“The new connectors address the need for fast, electrically clean and flexible connectors in high-performance systems while providing a backward-compatible solution with legacy connectors,” said John Holba, product manager, Molex.
The connectors, which are designed for customers in markets including data, telecom, aerospace and defence, and industrial, achieve up to 25 Gbps data rates. “That represents a 150% data rate improvement over the existing Plateau HS Dock™ Connector, which provides data rates to 10 Gbps,” said Holba.