Molex introduces second-generation HSAutoLink Interconnect System

Molex Incorporated has introduced its next-generation HSAutoLink II Interconnect System. Delivering on the automotive industry’s need for multiple high-speed media protocols, the HSAutoLink II Interconnect System meets all these demands in one system. Typical applications include in-vehicle infotainment, telematic devices, radio and navigation systems, as well as meeting the rising demand for advance drive assist cameras used for pedestrian warning, night vision or blind-spot information, 360-degree and rear view vision systems.

“A dominating trend in automotive electronics is the proliferation of in-vehicle cameras for intelligent assistant systems; lane departure warning, collision avoidance and parking assist all make use of numerous cameras positioned at various locations on the vehicle,” says Mike Gardner, global marketing manager, infotainment and in-vehicle networks, Molex. “This, together with a move towards larger, higher resolution and 24-bit colour imagery, is increasing the bandwidth requirements for the transport network. The next generation, HSAutoLink II interconnect system addresses these evolving requirements and the needs of OEMs by providing a cost-competitive connector system with data rates in excess of 2.0 Gbps and the ability to support different communication networks or protocols.”

Both a flexible and expandable product family, the HSAutoLink II is offered initially with 6 and 12 circuits providing flexibility for combined links or support for multiple protocols in the same connector, including USB 2.0, USB 3.0, LVDS, Ethernet AVB (Audio Visual Bridging), and modified HDMI, DVI and DisplayPort. Use of shielded twisted-pair (STP) or jacketed unshielded twisted pair (JUTP) cabling provides a range of options for cost-competitive solutions for high-speed differential signalling applications.

The HSAutoLink II Interconnect System uses the field-proven terminal interface designed for high pin-count signal applications requiring high reliability and high-speed signalling performance. The low contact insertion force (0.5N per circuit) is achieved through a terminal design that gradually separates the receptacle contacts for high durability withstand up to 5000 mating cycles with a standard gold plating finish. The 2 contact beams provide multiple current paths with minimal length, and low and stable contact resistance; this contact geometry and density promotes high bandwidth performance with a nominal data-rate measured between 3 to 4 GHz in a differential signalling environment. Contact system provides current carrying capacity of 1.5Amps (continuous).

The fully-protected shield case for the harness connector (sealed or unsealed) and closed shield case on the mating soldering side or In-line connection, provides superior EMI performance. In addition, the sealed connector system employs a fully-protected perimeter seal and wire seal to meet the harsh requirements according to IP69K.

A major supplier to the global automotive industry, Molex offers vehicle manufacturers and their suppliers a wide range of products and extensive research and development capabilities that include rapid prototyping and high volume production support. All Molex manufacturing sites are ISO 9000 and QS 9000 certified.

www.molex.com

 

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