Once encapsulated, this DMP can be welded or soldered directly to a rugged connector or termination and further potted or over-molded. The dual mold package simply makes the need for a conventional PCB arrangement redundant. Dedicated ears allow greater accuracy levels to be realised when mounting.
The sensor device can be used in either linear or rotary position sensing applications and features fully programmable transfer functionality, selectable analogue and pulse width modulation (PWM) output modes, open/short diagnostics, on-board diagnostics, under-voltage detection and over-voltage protection. A SENT-SAE J2716 capable version is currently under development.
“The MLX90364 addresses the automotive industry’s demands for more electrical, mechanical and environmental robustness”, commented Vincent Hiligsmann, Marketing Manager for Sensors at Melexis. “Combining the dual mold package with our latest generation of Triaxis position sensor ICs, means that the vulnerability often associated with use of PCBs when they are exposed to high temperatures or high levels of vibration can be avoided. By using fewer components and lowering the number of solder-joints by more than a factor of 3, the risk of failures is decreased greatly. PCB-less mounting allied to contact-less sensing offers a solution that is fully optimized for long term reliable performance.”
Melexis is currently shipping it’s NoPCB solution to several automotive tier 1 suppliers.
The MLX90364 is qualified according to the AEC-Q100 and Q200 automotive standards. It has passed extreme robustness validation tests, such as long exposures to ambient temperatures up to 170 ⁰C.