CIE Components in Electronics
Demand has increased in recent years for applications with lower power consumption by the overall system, longer running time when using battery power, and smaller and thinner form factors. Power MOSFETs are used in charge control switches for Li-ion secondary batteries and power management switches for power supply switching with AC adapters.
These devices must be able to handle the large current flows needed to operate the system overall, and this has brought demand for reduced operating resistance (on-resistance) in order to lower system power consumption. At the same time, there is strong demand for smaller and thinner Li-ion battery packs become slimmer and more compact. This means that power MOSFET products with smaller packages than the conventional SOP-8 are needed.
In response to this demand, Renesas has developed a new fabrication process employing ultrafine process technology, among other innovations, that reduces the on-resistance by half for the same effective area compared with the earlier process used to fabricate MOSFETs for similar applications. The five new products, including the μPA2812T1L, deliver low on-resistance in very compact packages.
The compact 3.3 mm square package (HVSON(3333)) provide excellent heat dispersion. It is designed to allow heat from inside the package to be dispersed to the mounting board via the exposed lead frame. Since the amount of heat around the device is less than with packages such as the SOP-8 with less efficient heat dispersion, it is possible to design Li-ion battery packs, etc., that are thinner and more compact.
Renesas plans to further extend its lineup of power MOSFET devices with additional improved features and more compact packages. Kits combining power MOSFET devices and Li-ion battery charge control ICs, etc., will provide system designers with a broad array of flexible system solutions.
