Lattice Semiconductor to present its smart connectivity solutions at the first Mobile World Congress Americas 2017

Lattice Semiconductor Corporation, the leading provider of customisable smart connectivity solutions, will be presenting its smart connectivity solutions at the first Mobile World Congress Americas from 12-14th September 2017 at the Moscone Center in San Francisco.

Visitors can experience the latest innovations in smart connectivity solutions from Lattice Semiconductor and learn how Lattice’s FPGA and wireless technologies solve increasing demands of the consumer, mobile and communications markets.

Product demonstrations include:

  • Consumer & Mobile – Lattice products are being used in the most popular consumer and mobile products. Visit their booth to see what is driving the demand for Lattice solutions in smartphones, VR and other exciting product categories.
  • They will be demonstrating their CrossLink FPGA video bridging and signal aggregation solutions for camera and Edge applications, the iCE40 UltraPlus FPGA for emerging mobile applications, and their SiBEAM Snap wireless connector replacement technology.
  • Communications – Find out more about 60 GHz wireless infrastructure solutions based on our SiBEAM technology, which address the need for high capacity wireless links in urban Wi-Fi, LTE and fixed wireless broadband networks.

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