Lattice announces production of MachXO3L devices in WLCSP and caBGA packages

Lattice Semiconductor has begun volume production of its industry-leading MachXO3LTM family in four tiny packages as small as 2.5 mm x 2.5 mm.  Lattice has also launched two new low-cost breakout boards that enable designers to evaluate the MachXO3L device’s hard IP, versatile I/O and other capabilities.

These releases are intended to solidify the MachXO3L family’s lead in enabling engineers to quickly solve complex design problems in applications as diverse as industrial infrastructure and smart connected devices.

Lowest cost per I/O in the industry enabled by Wafer-Level Chip-Scale (WLCSP) and advanced Chip-Array BGA (caBGA) technology with package sizes as small as 2.5 mm x 2.5 mm and having up to 335 I/O in an industry leading 17 mm x 17 mm package. These enable engineers to fit big functionality in tiny spaces while maintaining cost competitiveness.

Low power leadership that includes an onboard regulator to simplify system design, eliminate thermal constraints and help engineers realize power efficient, always-on devices.

Instant-on capability with boot-up time of less than 1ms coupled with background system upgrade capability, dual boot and a single supply makes MachXO3L ideal for controlling bring-up and system initialization.

Hardened IP blocks including I2C, SPI, embedded memory, and an oscillator, all in an instant-on programmable fabric.  The MachXO3L devices also support MIPI D-Phy based DSI and CSI2 I/O.  These all help engineers design more quickly, improve reliability and reduce cost.

Commenting Keith Bladen, Corporate Vice President, Marketing said,  “Our non-volatile FPGA portfolio leads the industry with advanced 40 nm technology. The demand for MachXO3L devices is strong and growing with nearly 200 unique customers across a wide range of markets including industrial, communications and consumer.”

www.latticesemi.com

 

 

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