Kontron has introduced ULP-COM standards-based Computer-on-Modules to help embedded OEMs drive down the system costs for ultra-low power SFF (small form factor) solutions. Kontron”s expanded ULP-COM portfolio has been designed to provide a highly scalable building block for the cost-effective development of energy-efficient mobile devices. Featuring an extremely low TDP (Thermal Design Power), the Kontron ULP-COM-sA3874i is suited for space-constrained, fanless and harsh environment applications.
Offering single core ARM Cortex A8 technology performance based on Texas Instrument”s AM3874 Sitara ARM processors, Kontron”s latest ULP-COM module delivers the computing power required by the diverse range of smart devices being designed today in an exceptionally small 82 mm x 50 mm footprint.
The Kontron ULP-COM-sA3874i module supports an extended operating temperature range of -40°C to +85°C and expands the scalable Computer-on-Module building block model to a broader range of SFF systems that must operate in harsh environmental conditions such as those in the military, industrial automation/HMI, digital signage and medical markets. Support for Android, Linux, WEC7, and additionally a variety of real-time operating systems on project request, enables embedded OEMs to leverage an active ecosystem of development partners.
Kontron”s ULP-COM modules support 3D graphics acceleration and HD video processing. Dual independent displays are possible via parallel 18/24 bit LCD or 18/24 bit single-channel LVDS and HDMI. Additionally, the module supports a parallel camera interface input. The modules provide a x1 Gen 2 PCI Express lane and interface flexibility with 4-bit SDIO and SDMMC storage, SPI x2, I2S x4, I2C x4 for general purpose and CAN Bus x 2. Networking is supported by a 10/100/1000 Gigabit Ethernet port.
The ULP-COM-sA3874i module family is available for sampling now with serial production in Q1 2013.