Keithley adds high power wafer-level testing to auto characterization suite software

Keithley Instruments has announced a number of significant enhancements to its Automated Characterization Suite (ACS) software that looks to support its expanding family of high power semiconductor characterization solutions. The ACS package has been optimised for automated wafer-level parameter test applications, including automated characterization, reliability analysis, and known good die testing.

The ACS V5.0 update specifically leverages the high power capabilities of Keithley’s Model 2651A (high current) and Model 2657A (high voltage) System SourceMeter SMU instruments to enable automated wafer-level testing of high power semiconductor devices such as power MOSFETs, IGBTs, BJTs, diodes, etc.

The ACS combines multiple instruments into a unified test environment and is able to offer greater levels of flexibility, speed, and productivity in both testing and analysis. Users can go from creating a new test setup to characterizing new devices in a fraction of the time required by older test development approaches.

The update includes a variety of enhancements that include: high power device libraries designed for use with Models 2651A (up to 50A or 100A when connecting two units) and 2657A (up to 3,000V) System SourceMeter SMU instruments that support testing multi-terminal power components in conjunction with lower power Series 2600B SourceMeter SMU instruments or the Model 4200-SCS Parameter Analyzer; support for hardware scan, recognition, and configuration management of the high power Models 2651A and 2657A so users can quickly connect these instruments to a PC, confirm connectivity, and begin testing as well as support for Series 2600 SMU instruments equipped with the TSP-Link inter-unit communication bus, leveraging the on-board test script processor (TSP) technology for a multi-processor environment that provides high parallel throughput while speeding and simplifying test project development.

The update also includes sample projects for tests such as high voltage wafer level reliability (WLR) that build on the wide range of low power reliability test capabilities provided in earlier ACS releases, providing users with an excellent starting point for creating or modifying new tests quickly.

Also available is support for the ±200V C-V capability of the Model 4200-CVU-PWR C-V Power Package option for the Model 4200-SCS Parameter Analyzer to provide a broad range of I-V and C-V measurement capability for full characterization of semiconductor power components.


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