Intersil Corporation has announced the launch of the ISL8225M, the industry’s first 30A fully-encapsulated power module. The ISL8225M features the industry’s highest power density and dramatically simplifies the design of high-performance board-mounted power solutions.
The device can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A output. Current sharing and phase interleaving allow up to six modules to be paralleled for 180A output capability. Greater efficiency and low thermal resistance will enable full power operation without heat sinks or fans.
According to Intersil only a few external components are needed to create a very dense and reliable power solution. And the QFN package with external leads permits easy probing and visual solder inspection.