Future Facilities wins Design Tools and Development Software Award at Elektra Awards 2018

6SigmaET, a thermal simulation CFD tool designed by Future Facilities, was last night announced as the winner of the Design Tools and Development Software Award at the Elektra Awards 2018.

For more than 10 years, the Elektra Awards have celebrated excellence in technological innovation, recognising the very best achievements of the electronics industry, from manufacturers and distributors to designers and engineers.

Judged by an expert panel of top industry insiders, the ‘Design Tools and Development Software Award’ was selected from a shortlist of seven leading names from the electronics design industry. At last night’s award ceremony, hosted at the Grosvenor House Hotel in London, the judges declared the latest version of 6SigmaET to be the most innovative software design product to have been developed and launched in 2018.

Chosen as a result of its unique features and dramatically increased solving speed, Release 12 advances upon the existing thermal simulation technology available in 6SigmaET and represents the first ever thermal simulation platform to adopt virtual reality support.

Using VR, 6SigmaET enables engineers to physically enter their designs, allowing them to ‘walk around’ inside their simulations and spot potential thermal complications in 3D. This addition shows a glimpse into the future of electronics design, helping to provide engineers with a whole new perspective on thermal management.

Additional product developments introduced in Release 12 and recognised by the judges include:

  • 6SigmaET’s unique and superfast unstructured gridding capability
  • Thermal models and Papst and Parker Chomerics materials and designs
  • The ability to create compact DELPHI thermal models of components
  • The ability to run variations of designs with far greater accuracy

An independent study conducted by international electronics group Rohde & Schwarz also found 6SigmaET’s platform to be 35 per cent faster than its nearest competitor within the thermal simulation market.


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