FCI, a supplier of connectors and interconnect systems, has announced the release of the BarKlip I/O Power Connector. The BarKlip I/O connector, rated for up to 200Amps/contact per UL & CSA criteria, offers improved electrical performance and long-term reliability compared with alternative designs.
Designed to meet the Open Compute (OCP) Power Distribution Architecture Standard, the connector can connect with a system rack bar to achieve a direct pluggable connection to an uninsulated busbar. The connection generates low energy loss with a maximum resistance of only 0.2mOhms per contact.
The BarKlip I/O Connector features 14 fully independent cantilevered beams, which provide a true compliant spring to adjust for variations in busbar alignment and surface finish. In addition, the BarKlip I/O connector is a floating panel mount design. An installed height of <34mm enables their use in 1U rack-mounted equipment commonly found in datacenters and new hyperscale computing architectures. The available wire range is 14AWG to 2AWG, allowing users to define the wire gauge and length flexibly in terms of actual requirement.
The BarKlip I/O Connector has been designed to operate between -40°C and 125°C.
“The BarKlip I/O Connector provides a convenient, low voltage loss and highly reliable method to connect to many of FCI’s busbar power distribution solutions” said Michael Blanchfield, Portfolio Director for Power Solutions at FCI. “FCI’s proprietary plating technology adds an additional benefit to customers by providing maximum conductivity and longer-term reliability without concerns for corrosion. We are confident the BarKlip products will meet many of our customers’ demands for high reliability in direct connect busbar applications.”