CIE Components in Electronics
FCI has strengthened the portfolio of its MezzoStak Mezzanine connectors with the addition of 80 and 90 position offerings. These new variations’ stub-less contact interface supports PCIeGen2 compatibility and facilitates high speed performance of up to 5Gb. These characteristics enable the connectors to support communications and networking applications with higher signal transmission.
The MezzoStak Mezzanine connectors feature an innovative hermaphroditic “mate-to-itself” design that reduces product mix and simplifies connector selection, documentation and component maintenance. This allows engineers to significantly reduce cost and time spent in the design and maintenance phase.
In addition, this design catalyzes the consolidation of part numbers and components, which helps to increase the relative volume of this connector category and further drive down manufacturing cost. The consolidation also alleviates supply chain and inventory burdens for electronics component distributors and manufacturers alike. The significant cost savings that FCI’s MezzoStak Mezzanine connectors provide make them a viable low cost alternative to high-speed mezzanine connectors across many industries.
The four guidance “scoops” integrated in their design permit easy mating and precise connections even when miss-aligned. Their polarisation feature also eliminates the chance of mis-mating and prevents errors in Printed Circuit Board (PCB) placement. This helps OEMs to save assembly time during the production stage and accelerate time-to-market. This also safeguards the quality of end products by reducing assembly errors.
This family of 0.5mm fine pitched, high density mezzanine connectors is also compact and allows design engineers to save real estate on the PCB. This space-optimizing feature allows design engineers to use the freed PCB space to integrate more functions or boost existing performance, while still retaining an overall compact design.
