ERS introduces cutting-edge innovation in semiconductor thermal testing

ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is announcing a major innovation in its product range of thermal test solutions for the semiconductor industry, significantly boosting user flexibility and cost effectiveness.

The new AirCool PRIME family of thermal chucks, developed in close cooperation with MPI Corporation, offers unsurpassed flexibility and the industry’s fastest transition times. With this achievement, the system greatly increases the customer’s test throughput. Likewise, the system features the largest variety of thermal ranges on the market, offering the unmatched flexibility over a wide range of semiconductor test applications.

Available initially for 300mm (12”) wafers, the ERS AirCool PRIME incorporates a flexible and modular top plate design concept allowing easy field upgradeability. Through the integration of the PRIMETM Thermo Shield (PTS) into the chuck, the AirCool PRIME products drastically shorten the soaking times within the test cycle. Thus, the system achieves Instantly-Ready-For-Test IRFT capability. It creates a mini-environment around the chuck which results in fast and accurate tests. Its ultra-low signal noise in the single-digit Femto-Ampere (fA) range allows extreme sensitive measurement.

In order to tailor the system’s thermal capability to the customer’s requirements and budget, the system can be configured for a variety of temperature ranges between -60°C and +300°C. Through ERS’ Super Booster technology, test temperatures down to -10°C can be achieved without a separate chiller. For lower test temperatures, down to -40°C, ERS is offering a compact chiller which occupies only one third of the footprint of comparable systems.

“Co-developing the Air Cool PRIME technology with ERS Electronic has enabled significant advancements in feature sets that enable mutual customers to become much more effective and efficient in thermal wafer probing applications,” says Stojan Kanev, general manager of MPI Corporation’s Advanced Semiconductor Division. “Combining the talent of our organisations has once again proven highly successful in terms of providing powerful, customer oriented solutions. Reductions in equipment footprint size and significantly reduced CDA consumption are two critical cost savings the AirCool PRIME Technology provides yet it is the optimised thermal management, quick set-up, distinguished electrical performance and enhanced throughput that are absolute game changers.”

“We were very pleased with the cooperation with MPI which has given us valuable insights and expertise in the challenging analytical wafer probing market,” comments Klemens Reitinger, CEO of ERS electronic GmbH. “Today’s semiconductor market with megatrends like IoT, electromobility and renewable energies, places extreme requirements on chips in terms of high-frequency and high voltage technology. It is precisely the customers focusing on these application fields that will benefit most from our new innovations. For example, AirCool PRIME enables fast and thorough testing of power semiconductors for voltages up to 12kV,” explains Reitinger. “MPI’s experience in the highly challenging RF Probing helped us include innovative features for testing High Speed and RF circuits for the IoT market,” he adds.

www.ers-gmbh.de

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