Dialog Semiconductor first to utilise Cadence IP for next-generation connectivity products

Dialog Semiconductor, a provider of integrated power management, audio, AC/DC and short-range wireless technologies, has announced that it has licenced Tensilica HiFi Audio/Voice DSP IP from Cadence Design Systems. Dialog will initially deploy the IP to develop next-generation audio solutions for its connectivity products.

Cadence Tensilica HiFi Audio/Voice DSPs are currently the industry’s most widely used licensable audio/voice DSP family, and are supporting over 100 proven audio/voice software packages that have been optimised to enhance the audio experience of users.

“Sound quality, performance and low power architecture are critical contributors to our reputation and success with our leading customers,” said Mark Tyndall, vice president of corporate development and strategy at Dialog. “The HiFi Audio/Voice DSP delivers in all these areas and has a comprehensive software partner ecosystem, which is essential for the connectivity and portable device markets we serve.”

The HiFi Audio/Voice DSP is part of the broader Tensilica product offering that combines the best capabilities of DSPs and CPUs while delivering 10X to 100X the performance because they can be optimised using automated design tools to meet specific and demanding signal processing performance targets.



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