CIE Components in Electronics
LG’s high-performance 3D camera module utilises Rockchip RK1608 with multi-core CEVA-XM4 vision DSPs to process a range of advanced workloads – including Simultaneous Localisation and Mapping (SLAM), Stereo Disparity and 3D point cloud – for a wide range of markets and applications
CEVA, Inc., the leading licensor of signal processing IP for smarter, connected devices, announced a partnership with LG Electronics, a global leader in consumer electronics and appliances, to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications.
The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of 3D sensing applications. These include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection, AR and VR. Computer vision experts from CEVA, Rockchip and LG worked closely together to optimise LG’s proprietary algorithms for the CEVA-XM4 using CEVA’s tool kit and optimised algorithm libraries ensuring optimal performance under stringent power constraints.
“There is a clear demand for cost-efficient 3D camera sensor modules to enable an enriched user experience for smartphones, AR and VR devices and to provide a robust localisation and mapping (SLAM) solution for robots and autonomous cars,” said Shin Yun-sup, principal engineer at LG Electronics. “Through our collaboration with CEVA, we are addressing this demand with a fully-featured compact 3D module, offering exceptional performance thanks to our in-house algorithms and the CEVA-XM4 imaging and vision DSP.”
“We’re delighted to announce our collaboration with LG for the 3D camera module market,” said Ilan Yona, vice president and general manager of the Vision Business Unit at CEVA. Our CEVA-XM family of imaging and vision DSPs and software development environment allows companies like LG to deploy their in-house developed computer vision and deep learning technologies quickly and efficiently.”
LG will be presenting and demonstrating their smart 3D module at the CEVA Technology Symposium Series in China and Taiwan, October 23rd to October 27th, 2017. Visitors can meet computer vision experts from CEVA and LG at these events. For more information on how to register, please visit the Symposium website at http://events.ceva-dsp.com/symposium-2017-en/.
CEVA’s latest generation imaging and vision DSP platforms address the extreme processing requirements and low power constraints of the most sophisticated machine learning and machine vision applications used in smartphones, surveillance, augmented reality, sense and avoid drones and self-driving cars. These DSP-based platforms include a hybrid architecture composed of scalar and vector DSP processors coupled with a comprehensive Application Development Kit (ADK) to streamline software deployment. The CEVA ADK includes: CEVA-Link for seamless software level integration with a host processor; a range of widely used and optimised software algorithms; the CEVA Deep Neural Network (CDNN2) real-time Neural Network software framework which streamlines machine learning deployment at a fraction of the power consumption of the leading GPU-based systems, and; state-of-the-art development and debugging tools. For more information, visit www.ceva-dsp.com/app/imaging-computer-vision/.
