Press Releases

Spirent and MultiLane join forces to enable 800G ecosystem

Spirent Communications, the provider of test, assurance, and analytics solutions for next-generation devices and networks, has partnered with MultiLane, a specialist in data centre interconnects, to offer vendor-neutral testing solutions supporting the 800G ecosystem. This milestone is a result of the two companies’ joint mission to enable 800G infrastructure development …

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300W and 1,000W programmable electronic DC loads offer multiple operating modes, high-speed response times and linear start-up from 0V

TDK Corporation has introduced the TDK-Lambda brand SFL series of programmable electronic DC loads. The series comprises 300W and 1,000W power levels and either a 120V or 500V maximum rating. The SFL incorporates high-speed current feedback control to eliminate load current overshoot and oscillation to generate a stable and predictable …

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Best-in-class power saver further improved now: Ultra Low Power SiP Nordic nRF9160 Gen2 at Rutronik

It doesn‘t get much more efficient than this: the compact, highly integrated SiP nRF9160 enables the straightforward implementation of low-power LTE technology and offers advanced processing and security functions for a variety of single-device with low-power designs for the cellular IoT. With the latest release, Nordic‘s already highly efficient system-in-package …

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DATA MODUL presents 55-inch UHD2 display for digital signage applications

DATA MODUL, a provider of display, touch, embedded, monitor and panel PC solutions, has expanded its digital signage portfolio and presents a new 55-inch UHD screen (DM550WUHD2225-0-0-DM-B01), which is designed, developed and manufactured completely in-house. The high resolution and brightness as well as its slim design, make the monitor ideal …

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Equipment partners of IES combine their photonics expertise at SPIE Photonex + Vacuum Technologies 2021

IES, a partner of R&D and semiconductor equipment specialists, will be attending SPIE Photonex + Vacuum Technologies 2021 to discuss processing equipment for photonics applications. IES represent a selection of equipment manufacturers, including EV Group (EVG) and scia Systems (scia). EVG, a supplier of wafer bonding and lithography equipment, recently …

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UnitedSiC announces 6mohm SiC FET

UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, has responded to the power designer’s requests for higher-performance, higher-efficient SiC FETs with the 750V, 6mohm device. At a RDS(on) value of less than half the nearest SiC MOSFET competitor, according to UnitedSiC, the new 6mohm device also provides a robust …

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New panel PC coupling for ROLEC’s profiPLUS suspension arms

ROLEC has added a new 50/48 rotating elbow coupling to its profiPLUS 50 range of modular suspension arms – making it quicker and easier to install panel PCs. Advanced profiPLUS 50 is suitable for a wide range of industrial control and display applications including machine building, process automation, machine control …

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Murata adds new capabilities to its highly versatile id-Bridge RFID management solution

Leveraging the technical strength it has built up in the RFID business over more than two decades, Murata now launches its id-Bridge suite 4.0. This advanced web-based platform enables end-to-end management of RFID systems on any scale. It takes care of the acquisition, conditioning, aggregation and interpretation of data from …

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NXP complies with new standard for automotive cybersecurity

NXP cybersecurity engineering processes are now certified as compliant with the new automotive cybersecurity standard ISO/SAE 21434. NXP is said to be the first semiconductor supplier to be certified by TÜV SÜD to comply with the latest automotive cybersecurity standard ISO/SAE 21434. The new automotive cybersecurity standard aims to provide …

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