News

Gimme Five – Eric Janson

Steve Rogerson interviews Eric Janson, senior vice president for sales and marketing at ams. Janson was born in Michigan, USA, and has lived and worked in the US, Shanghai, China, Cambridge, England, and now resides in Munich, Germany. Janson holds a bachelor of engineering science degree, major in physics, and an MBA. Next year will be his 40th year in semiconductors, almost all in analogue, RF and mixed-signal circuits.

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productronica 2013 – show preview

The twentieth productronica is due to open in a few days and this world trade fair will be supported by a broad programme of events, forums and live demonstrations. Held every two years in Munich the event includes a CEO Roundtable, which this year focuses on Industry 4.0. The event is intended to promote the sharing of ideas and information across the electronics production sector and the productronica Forum and Innovations Forum Lectures will highlight a number of key topics and exhibition sectors.

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Hopes for faster computer processing boosted by new global research effort

A new international research collaboration has been announced which is looking to deliver highly accurate measurements of strain in materials at the nano-scale to drive innovation in next generation electronic devices. The European Metrology Research Programme’s Nanostrain project brings together public institutions from across Europe supported by global industry leaders including the likes of IBM and Global Foundries.

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Freescale i.MX 6Quad processor supports eyeglass-mounted device for visually impaired

Freescale Semiconductor is powering a new application from the Israeli startup, OrCam, that has been designed to help the visually impaired interact more easily with the world around them. The OrCam solution is a compact, eyeglass-mounted device that employs sophisticated computer vision algorithms running on Freescale’s high-performance i.MX 6Quad applications processor to interpret visual inputs and communicate their meaning in real time to the person wearing the device.

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Sensirion joins Atmel’s sensor hub platform ecosystem boosting development of smarter devices

Sensirion has anounced that it has partnered with platform manufacturer Atmel to create an easy-to-use and power efficient sensor hub solution. This agreement will mean that  Sensirion will be able to provide its customers with turnkey sensor hub solutions and enable designers to create smarter connected devices including mobile devices and wearables.

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Protect and survive

Paul Currie, Sales & Marketing Director at MPE Ltd, looks at the impact solar superstorms caused by the sun"s constantly changing surface plasma can have on engineering infrastructure and assesses some of the techniques that can be employed to protect it from damage.

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UK researchers claim li-fi via LED light bulb breakthrough

Just a couple of weeks after Chinese scientists claimed a breakthrough in wireless internet connectivity using light- or "li-fi" - UK researchers have announced that they have achieved data transmission speeds of 10Gbit/s via "li-fi".

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XMOS and Silicon Labs join forces to deliver the next wave in programmable SoCs

XMOS, a specialist in multicore microcontrollers, and Silicon Labs have announced a technology partnership that will allow XMOS to integrate energy friendly ARM technology into its xCORE multicore microcontrollers to produce the next wave in programmable system-on-chip products (SoCs).

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Thermally-conductive polymer gives 25 percent performance increase

Carbodeon has developed a thermal filler using nanodiamonds that increases the conductivity of thermally conductive polymers by 25 percent, providing significant performance increases for polymers used in electronics and LED manufacture.

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