News

Significant improvement in wear resistance from nanodiamond-enhanced electroless nickel plating

Carbodeon Ltd. Oy has announced significant improvements to electroless nickel including a 3x improvement in wear resistance through the controlled addition of nano-diamonds. Nano-diamond particles are hardwearing, small, and offer very low surface friction. Since their discovery in cold war Russia, they have been a little-known secret used to improve the performance of hard chrome plating.

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Smartphone connectivity creates opportunities and challenges for automotive processor chip suppliers

The use of smartphones in motor vehicles—already a near-ubiquitous phenomenon—is currently the most disruptive trend in the automotive infotainment business, presenting both challenges and opportunities for automakers and their processor semiconductor suppliers, according to a new report from IHS Technology.

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NXP to deliver V2X chipset for mass-production secure connected cars

NXP Semiconductors has announced a significant breakthrough for automotive drivers around the world. For the first time, V2X chipsets will be put into high-volume manufacturing. NXP will supply Delphi Automotive PLC with its RoadLINK chipset for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communication. The wireless technology significantly improves road safety by alerting drivers of critical traffic information. Having secured a partnership with a leading global automaker, Delphi’s platform will be first to market and is expected to be on the roads in as little as two years.

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UKESF announces boost in industry support for electronic engineering undergraduate scholarships

The UKESF has announced industry backing from 25 leading electronics companies to fund up to 65 scholarships for elite electronics engineering undergraduate students for the 2014/15 academic year. Since the launch of UKESF, employers from the electronics industry have awarded a total of 174 UKESF scholarships, backed by over £1 million investment.

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Raytheon UK and Newcastle University team to investigate silicon carbide interface defects

Raytheon UK’s semiconductor business unit in Glenrothes, Scotland, has embarked on a Knowledge Transfer Partnership (KTP) project, in conjunction with researchers at Newcastle University, to enhance the performance of Silicon Carbide (SiC) electronic devices, specifically for Raytheon’s own SiC CMOS process.

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Huawei selects TrueTouch Gen5 touchscreen controller for MediaPad X1 tablet

Huawei has selected the TrueTouch Gen5 capacitive touchscreen controller from Cypress Semiconductor for the MediaPad X1 tablet. The new tablet employs the Gen5 TMA568 controller’s gloved finger tracking and hover support for its 7-inch touchscreen display.

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Microsemi to acquire Centellax

In a move designed to strengthen its MMIC design technologies and communications product portfolio Microsemi Corporation has signed an agreement to acquire Centellax, a Californian-based supplier of high-speed analogue and RF semiconductor products for the optical communications and Ethernet datacom markets. The terms of the transaction were not disclosedensuring our customers continue to rely upon us as their total solutions provider.

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Renesas establishes R-IN Consortium to support industrial ethernet equipment development

Renesas Electronics is to establish the R-IN Consortium, aimed at providing global support for the development of industrial equipment incorporating industrial Internet communication functionality, including manufacturing equipment, security cameras, and robots. The consortium is seeking corporate partners willing to supply software, OSes, development environments, system integration services, etc., and plans to commence official activities in April 2015.

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Microlease launches certified pre-owned programme

Microlease has announced the launch of Microlease Certified Pre-Owned, a comprehensive programme to address growing customer demand for quality test instruments with guarantees and calibration. Microlease Certified Pre-Owned will include instruments from leading manufacturers including Keysight Technologies, Anritsu, Rohde & Schwarz and Tektronix.

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Murata joins EEBus smart home connectivity initiative

Murata has become a member of the EEBus smart home connectivity initiative. Other members include many well-known international consumer, industrial and technology organisations such as Schneider Electric, Bosch and SMA, The initiative has the goal of bringing partners together to facilitate the link between networking standards and energy management capabilities of the smart grid to the increasing range of connected and controlling devices that are now becoming present in the smart home.

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