News

Peregrine looks to expand European operations with Reading facility

Peregrine Semiconductor, a fabless provider of high-performance radio frequency integrated circuits (RFICs), is expanding its European operations with the opening of a design, development, and sales facility in Reading, United Kingdom. The company’s UK facility will focus on developing dedicated RFIC products of European content, to better address the European requirements; including those of the European commercial, industrial, and high-reliability (hi-rel) markets, which have been a cornerstone for Peregrine’s successful growth across Europe.

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Nujira passes new patent milestone

Nujira, the innovative company behind Envelope Tracking (ET) technology, has announced the filing of its 175th ET patent. Since the Company’s formation in 2002 Nujira has developed an extensive and complete patent portfolio around ET, giving the company a dominant position in the industry. The company began working on ET technology 2-3 years before any other company, giving it a significant headstart on the industry. It also meant that the company overcame the “real world” challenges of ET years before others, and Nujira has protected these innovations with a growing patent portfolio. Nujira was responsible for 30% of all new ET patents published in 2011.

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Distribution in a changing world

Graham McBeth, President of Avnet Abacus, talks to CIE about the importance of adapting to change in the distribution market which in 2012 is a very different picture to the one of thirty years ago when the industry was awash with small dealers knocking on customers’ doors. 

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Xilinx acquires wireless backhaul solutions provider Modesat Communications

Xilinx has acquired Modesat Communications, a high performance wireless backhaul solutions provider. OEMs focusing on mobile backhaul platforms will now be able to take advantage of Xilinx’s All Programmable 7 series FPGAs and Zynq-7000 SoCs combined with Modesat wireless backhaul solutions. Xilinx wireless mobile backhaul solutions provide faster time-to-market and will now be able to offer OEMs, who are constrained today by limited merchant IP options, an alternative solution.

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PC share of DRAM market falls below 50 percent for the first time

Has the technology industry entered the post-PC era? New figures from IHS iSuppli suggest it has as they show that during the second quarter of 2012 personal computers accounted for less than half of the market for DRAM, the first time in a generation that they didn’t consume the majority of the leading type of semiconductor memory. PCs in the second quarter accounted for 49.0 of DRAM bit shipments, down from 50.2 percent in the first quarter, according to the latest IHS iSuppli DRAM Dynamics Brief.

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Maxim Integrated launches new corporate venture group

Maxim Integrated Products has established a Corporate Venture Group to invest in startup companies and innovative technologies. Through the new Corporate Venture Group, Maxim said that it would be making strategic investments in seed technologies that align with the company’s focus areas, products, and initiatives, and facilitate partnering for Maxim’s business units with smaller companies.

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Samsung breaks ground for new memory manufacturing complex in China

Samsung Electronics has held a ground breaking ceremony for a major new memory fabrication line in Xi"an, China. Once completed, the new facility will make use of advanced 10-nanometer (nm)-class technology in producing NAND flash memory chips, a critical component powering IT and mobile applications for high-speed and large-density data storage.

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X-FAB goes 3D with new foundry service

X-FAB Silicon Foundries, which has shipped more than a billion MEMS devices, has announced the industry"s first open-platform MEMS 3D inertial sensor process that will be available directly from a high-volume pure-play foundry. With access to the new 3D inertial sensor process, fabless and other companies will be able to apply their own design or use X-FAB"s design partner, and immediately run wafer volumes without long and costly process development.

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Toshiba offers European customers flexible foundry service

Toshiba Electronics Europe (TEE) is now offering its European ASIC customers a flexible process development and foundry manufacturing service built around its 8” (200mm) CMOS wafer fabrication capabilities. The service combines support for special processes, process modifications and bespoke process development with cost-effective medium- and high-volume manufacturing that is backed by a commitment to long-term supply.

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Premier Farnell partners with Sony UK Technology Centre to manufacture the Raspberry Pi in the UK

The electronics distributor, Premier Farnell, has agreed a multi-million pound deal with Sony UK Technology Centre (UKTec) that will see the revolutionary Raspberry Pi computer manufactured in the UK for the first time. The deal must be seen as a major coup for the UK’s manufacturing industry and represents a return home for the innovative British-designed Raspberry Pi, which to date has only been manufactured in China.

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