News

Cliff add DualSLIMS space saving narrow FeedThrough Connectors to the existing SLIMS range

Cliff Electronics leaders in the design, development and manufacture of connectors and test equipment, have extended their SLIMS FeedThrough Connector series with the introduction of the new DualSLIMS range which allows customers to choose between mounting the connector adapters from the front of the panel which permits simple and fast changing of …

Read More »

Professional SBC User Survey launched by Farnell

Farnell, an Avnet Company and global distributor of electronic components, products and solutions, has today launched a new global survey to understand how single board computers (SBCs) such as Raspberry Pi, Arduino and BeagleBone are being used in professional design to speed up product development and reduce time to market. …

Read More »

Digital services save time in design

Efficient data management in engineering can help save time and money during the design phase. New digital services greatly facilitate the data management for HARTING products and solutions. Behind every electrical engineering project are many individual components and thus a whole collection of data: 2D/3D CAD data, data sheets, type …

Read More »

Rohde & Schwarz hosts Oscilloscope Days 2021, a new two-day digital seminar event

Oscilloscopes take centre stage at the online educational event organised by Rohde & Schwarz in partnership with Würth Elektronik and Farnell. Held in May 2021 and catering to electronics engineers from around Europe and beyond, participation at the Oscilloscope Days 2021 is free. The live sessions will be streamed simultaneously …

Read More »

European Project releases surveys aimed at the Robotics community

Robotics4EU, a three-year project funded under the European Commission’s Horizon 2020 programme, is releasing two surveys to support the project implementation and its goal: to boost a wider adoption of robotics in Europe. Developed as a basis for foundational work and to support the Robotics4EU project implementation, which started in …

Read More »

COMAU’S NEW RACER-5 COBOT DELIVERS HIGH-PERFORMANCE COLLABORATIVE ROBOTICS AT INDUSTRIAL SPEED

Comau introduces its RACER-5-0.80 (Racer-5 COBOT), a new paradigm in collaborative robotics which meets the growing demand for fast, cost-effective cobots that can be used in restricted spaces and in different application areas. Countering the belief that collaborative robots are slow, Racer-5 COBOT is a 6-axis articulated robot that can …

Read More »

LEM launches new Leakage Current Sensor for Electric Vehicle Charging Stations

LEM launches the CDSR, a new leakage current sensor based on its open-loop Fluxgate Technology. The CDSR is innovative, extremely compact and safe, allowing manufacturers to optimize the electronic design of their charger products. With a worldwide total of only 7.3 million EV charging points, of which 6.5 million were …

Read More »

TT Electronics’ non-contact reflective object sensor

TT Electronics, a global provider of engineered electronics for performance critical applications, today announced its new OPB735 series Reflective Object Sensors for the most challenging industrial automation and safety applications. This reflective sensor features hermetically sealed components offering designers a wide operating temperature range of -55°C to 100°C to suit almost any factory setting. Designed to produce extremely low cross talk or noise signal, this product provides users reliable and consistent …

Read More »

Digitizers and AWGs by Spectrum now support ARM-based NVIDIA Jetson

Following a number of requests from its customers, Spectrum Instrumentation now offers driver support for the NVIDIA Jetson, a series of embedded computing boards from NVIDIA. The new driver package means that any of Spectrum’s high-performance Digitizers, AWGs or Digital I/O products with PCIe interface, currently 65 different cards, can …

Read More »

Xilinx Expands into New Applications

Xilinx announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the …

Read More »