SIGLENT has introduced a new range of high-performance oscilloscopes to the UK with the help of Telonic Instruments Ltd. The SDS7000A oscilloscope range has been developed for dynamic markets, such as telecommunications, wireless technologies and high-speed digital technology. In these industries, oscilloscopes are required to provide expanded functionality to meet …
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Anglia Components PLC has expanded its support for Internet of Things designs following a new partnership with Digi International Inc. Anglia will now supply the Digi ConnectCore family of SOMs and the Digi XBee ecosystem of wireless modules, tools, and developer kits, which connect sensors and other devices to the …
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The rise of generative AI and AI/ML technologies is fuelling demand for more high-speed connections and, in turn, the push toward 800G connectivity in backend data centre networks and applications. This can be optimally addressed using Active Electrical Cables (AECs), but there are numerous design and development hurdles for cable …
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u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced the MAYA–W3 family, a series of compact dual-mode Bluetooth LE 5.4 modules with LE Audio. The modules also support Wi-Fi 6/E and are designed for demanding industrial applications, including healthcare, industrial automation and monitoring, asset …
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IMINT Image Intelligence AB (“Imint”), a global specialist in video enhancement software, has launched Vidhance for Remote Assistance, a new suite of subscription-based tools designed to transform the quality of video content captured by remote assistance devices. The new solution consists of the Vidhance Premium Video Stabilization feature, which is …
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MikroElektronika (MIKROE), the embedded solutions company that is said to dramatically cut development time by providing innovative hardware and software products based on proven standards, has introduced ANNA-B412 Click, a compact add-on board that provides BT/BLE connectivity for any embedded application. It features the u-blox ANNA-B412, a standalone Bluetooth 5.1 …
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Ventec International Group will once again team up with partner Taiyo to promote the synergy between Ventec’s substrate materials and Taiyo solder masks, at Productronica 2023, Munich November, 14-17 in Hall B3, Booth 242. Show highlights include Ventec’s new Battlam materials portfolio for advanced battery-management applications, alongside high-performing RF materials …
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NXP Semiconductors has announced the AW693, a new automotive-qualified wireless connectivity solution. Designed for automotive from the ground up and part of the industry’s most complete automotive wireless connectivity portfolio, the AW693 enables concurrent dual Wi-Fi 6E and Bluetooth 5.3 connections, protected by NXP’s integrated Edgelock secure subsystem, to deliver …
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Nordic Semiconductor, a specialist in low power wireless IoT solutions, has announced a significant addition to its nRF54 Series, its fourth generation of Bluetooth Low Energy Systems-on-Chip (SoCs). The nRF54L Series is the logical successor to the nRF52 Series, a product family that has seen several billion SoCs delivered to thousands …
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NeoCortec, the experts on wireless connectivity and providers of ultra-low-power bi-directional wireless mesh network hardware and software solutions, will have a strong presence at the upcoming 20th Wireless Congress: Systems and Applications 2023 at Konferenzzentrum Munich, Germany on 7th and 8th November 2023. Speaking at the event on 8th November from 13.30h-14h, Thomas Steen Halkier, NeoCortec …
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CIE Components in Electronics