GD Rectifiers Ltd has announced the completion of its acquisition of Harmsworth Townley & Co Ltd (Power Semiconductors/Electronics Division), a UK distributor of high power semiconductors across the industrial, communications, consumer and medical device markets. As part of the acquisition, GD Rectifiers has acquired the Harmsworth Townley business, product portfolio …
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Benetel, developer of 5G platform solutions for the telecommunications industry, has announced the launch of its flagship BNTL-RAN550 O-RAN radio unit (O-RU). This latest addition to the company’s RU product family delivers 100MHz of instantaneous bandwidth, with up to 250mW of output power per transmitter path. The combination of elevated …
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For solving the challenges of building and deploying telerobotic systems for extraterrestrial missions, like system design, systems integration and long-distance communication, the European Space Agency (ESA) opted for the software framework from Real-Time Innovations (RTI). They use RTI Connext DDS for communication and video to demonstrate long-distance object control from …
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Lattice Semiconductor Corporation, the low power programmable leader, has announced the Lattice Mach™-NX FPGA family, the second generation in its successful line of secure control FPGAs. Building on the capabilities of the Lattice MachXO3D™ family announced in 2019, Mach-NX FPGAs deliver heightened security features and the fast, power-efficient processing needed …
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Nokia today announced that Sandvik Mining and Rock Technology will deploy a Nokia 5G SA industrial-grade private wireless network at its test mine in Tampere, Finland. Based on Nokia Digital Automation Cloud (DAC), the 5G standalone (SA) network will be used to enhance communications and connectivity at the facility, a …
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Ensilica, a leading provider of custom ASIC design and supply services, has created a customisable single-chip medical sensor ASIC platform to speed the development of wearable medical / fitness vital-sign monitoring products. Called eSi-MediSense, it is the market’s only single chip medical sensor with wireless capability, and by being single …
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ON Semiconductor has introduced a new Bluetooth Low Energy mesh networking solution based on its ultra-low-power RSL10 System-in-Package (RSL10 SIP). Using the RSL10 Mesh Platform, engineers can easily implement ultra-low-power mesh networking, using Bluetooth Low Energy technology, and move quickly towards full deployment. Optimised for smart home, building automation, industrial …
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u-blox, a provider of positioning and wireless communication technologies, has announced its latest contribution to vehicle-to-everything (V2X) technology: the VERA-P3 V2X module. Based on the u-blox UBX-P3 V2X chip, VERA-P3 puts automotive OEMs, Tier-1s, and manufacturers of traffic management infrastructure on a fast track to integrating V2X technology into their …
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MediaTek today announced the Dimensity 820 system-on-chip (SoC) which is optimized for premium user experiences. The Dimensity 820 delivers ultra-fast 5G speeds, and is feature-packed with MediaTek’s latest multimedia, AI and imaging innovations. “Our Dimensity 1000 is already powering impressive flagship 5G devices in a number of markets. With the new Dimensity 820, …
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Molex announced that it has joined the SPE (Single Pair Ethernet) Industrial Partner Network, which brings together industry leading companies to promote and support adoption of SPE technology as the basis for rapid growth of IIoT (Industrial Internet of Things). “IIoT and Industry 4.0 are driving new standards in wired …
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CIE Components in Electronics