Thermal Management

Power supply reference designs solve railway-specific EMC and RIA12 surge-protection challenges

Two new RECOM railway power supply reference designs, available now at Dengrove Electronic Components, solve engineering challenges including filter layout for EN 50121-3-2 EMC compliance and surge prevention meeting the UK RIA12 specification. The R-REF04-RIA12-1 board targets high-voltage applications up to 110V, while the R-REF04-RIA12-2 is built to handle DC …

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Future Electronics releases rapid development platform for thermal imaging and IR sensing

Future Electronics, a global leading distributor of electronic components, has introduced an Arduino-compatible development board which implements contactless temperature measurement and far-field thermal imaging at a resolution of 32×24 pixels. The board may be used as a platform for the rapid development of various new smart system and IoT applications. …

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Two know more than one

Combining two devices using two different temperature measurement technologies, Fluke Process Instruments provides the glass industry with more information on high-value applications like float glass manufacturing, glass tempering, and windshield forming and laminating. Temperature profiling runs with a data logger enable operators to quickly optimise furnace settings for new products …

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ATS and West Electronic Solutions announce sales partnership

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce that it has signed West Electronic Solutions, a sales representative for electronic manufacturers and service providers with more than 50 years of success in the industry, to …

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ATS and Richardson RFPD announce new distribution partnership

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, and Richardson RFPD, an ARROW Company and specialised electronic component distributor focused on RF, wireless, IoT, and power technologies, are pleased to announce a new distribution partnership. The new line of ATS …

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Thermco Systems announces strategic partnership with Hitachi Kokusai Semiconductor Europe

Thermco Systems based in West Sussex, UK has announced a strategic partnership with Hitachi Kokusai Semiconductor Europe, strengthening its position as a leading manufacturer of horizontal thermal reactors. This new partnership makes available to Thermco’s European customers, the feature-rich Vertical Thermal Reactors ‘Vertron Revolution’ for the first time. Headquartered in Erkrath, Germany, …

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Fothershield’s new website now available

Fothershield’s new website showcasing a wide range of EMC and thermal management materials is now available to view online. EMC can be a problem, from board level through to final design. Fothershield is dedicated to work with the design engineer to find a solution to the problem. For board level …

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Thermally conductive dispensable PCM interface paste, 3.5W/m.K

New from European Thermodynamics – the latest addition to the thermal interface material range from brand Global Component Sourcing (GCS), the phase change material GCS-TRP35-PCM. Ideally suited to fill spaces of up to 0.15mm, the GCS-TRP35-PCM phase change thermal interface material is used to fill air gaps/voids between two surfaces. …

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New 6SigmaET release enhances modelling for faster thermal simulation

Future Facilities has launched Release 12 of its leading thermal simulation software, 6SigmaET. The latest release incorporates a number of significant modelling enhancements that deliver another boost to overall simulation speed – extending 6SigmaET’s performance advantage compared to alternative tools. Release 12 also includes a prototype virtual reality (VR) visualisation …

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Future Facilities launches neutral file format for thermal simulation models

Future Facilities, provider of leading thermal simulation tool, 6SigmaET, has today announced the availability of a new neutral file format that will help solve the challenge of sharing design models between different thermal simulation toolsets. The new file type will enable seamless file interchangeability – removing a major bottleneck in …

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