Power Solutions

Power Integrations launches gate drivers for 62 mm SiC and IGBT modules with fast short-circuit protection

Power Integrations, a specialist in gate-driver technology for medium- and high-voltage inverter applications, has announced a new family of plug-and-play gate drivers for 62 mm silicon-carbide (SiC) MOSFET and silicon IGBT modules rated up to 1700 V, with enhanced protection features to ensure safe, reliable operation. SCALE™-2 2SP0230T2x0 dual-channel gate …

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Toshiba launches photovoltaic output photocoupler for automotive

Toshiba Electronics Europe has released a new photovoltaic output photocoupler with an enhanced open-circuit voltage. The new device is primarily intended for use within solid-state relay (SSR) applications in automotive. However, it can equally be used in industrial applications, such as renewable energy. In recent years, automotive applications have become …

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Nexperia’s first SiC MOSFETs “raise the bar” for safe, robust and reliable power switching in industrial applications

Nexperia has announced its first silicon carbide (SiC) MOSFETs with the release of two 1200 V discrete devices in 3-pin TO-247 packaging with RDS(on) values of 40 mΩ and 80 mΩ. NSF040120L3A0 and NSF080120L3A0 are the first in a series of planned releases which will see Nexperia’s SiC MOSFET portfolio quickly expand …

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Danisense updating datasheets to enable engineers to easily calculate different technical values

Danisense, a specialist in high-accuracy current sense transducers for demanding applications, is updating all datasheets for its broad product range of current sense transducers to include formulas and examples to make it quick and easy for design engineers to calculate different values, e.g. current and voltage, linearity error, etc. Loic …

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Automate installation process with press-fit terminal power modules for a solder-free solution in high-volume manufacturing

The E-Mobility, sustainability and data centre markets require products that are conducive to high-volume manufacturing. To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB. Microchip Technology has announced that its expansive portfolio of SP1F and …

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TT Electronics opens new state-of-the-art power and control R&D facility in Manchester UK

TT Electronics, a global provider of custom power solutions and engineered technologies, has announced that its Power and Control business has officially opened its new state-of-the-art research, development and manufacturing facility. The new facility in Rochdale, Manchester, UK, is a strategic investment by TT Electronics in power electronics for mission-critical aerospace and …

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Toshiba launches first 30V N-channel common-drain MOSFET

Toshiba Electronics Europe has launched their first 30V N-channel common-drain MOSFET. The new SSM10N961L device offers low-loss operation and is specifically intended for use within devices with USB interfaces. Additionally, it may be used for protecting battery packs within mobile applications. With the ubiquity of USB interfaces, many components and …

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Vox Power releases VCCR300 conduction cooled PSU, slim 300W fan-less rugged 7.43” x 4.6” x 1” DC/DC

Vox Power Ltd has unveiled the VCCR300 Conduction Cooled Power Series, a robust rugged and highly reliable DC/DC power supply capable of silently delivering 300 Watts of power. Its compact size measuring only 7.43 x 4.6 inches with a 1-inch low profile, ensures easy integration in virtually any orientation, providing …

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Pulsiv signs strategic pan-European distribution agreement with WPG EMEA to further expand demand creation activities

 Pulsiv Limited, the Cambridge (UK) innovator of power electronics technology, has signed a pan-European distribution agreement with WPG EMEA. This important signing will see Pulsiv and WPG EMEA focus on demand creation activities to deploy Pulsiv OSMIUM technology throughout Europe, Middle East, and Africa enabling engineers to maximise efficiency, reduce energy waste, and lower …

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Farnell and Tektronix collaborate to bring a new video series on NXP LPCXpresso55S69 development board to the engineers

Farnell is hosting a video series by Tektronix taking a deep dive into one of the most popular development boards from NXP, the LPCXpresso55S69. The LPCXpresso55S69 is a powerful development board with an MCU based on the Arm Cortex M33 architecture. It features UART and SPI support, an audio subsystem, …

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