Features

Samsung Electronics is mass producing the most advanced DDR4 memory, these high-performance, high-density DDR4 modules can better support the need for advanced DDR4 in rapidly expanding, large-scale data centers and other enterprise server applications.

Toshiba Electronics Europe has launched an updated range of Super Speed USB 3.0 flash memory USB drives. The TransMemory-EX IITM drives feature increased read and write speeds and are available with capacities of 32GB, 64GB and 128GB.

Rutronik is stocking Osram Opto Semiconductors’ new multi-chip-LEDs. With a broad bright blue colour range lighting designers now have a free choice of colours for the interior lighting in vehicles. Colour design now covers cluster lighting to an increasing extent, notably in combined instruments such as speedometers and rev counters, in displays, as backlighting for switches and for ambient lighting.

FTDI Chip has released the VM800C – a family of credit card sized (85.6mm x 54.1mm) development module, and the VM800B – an encased version of this module in a fitted, plastic bezel. The portfolio is comprised of 11 specific part types in total, all based on the company’s Embedded Video Engine (EVE) platform - which provides display, audio and touch capabilities on a single chip.

Display specialist, Ginsbury has announced a new distribution agreement with Ocular, the US touch screen manufacturer. The agreement will see Ginsbury promote and market Ocular"s Crystal Touch: TRUE Multi-Touch projected capacitive (PCAP) touch screens in the UK and Ireland.

TE Connectivity’s new Power Triple Lock wire-applied connector system has been designed to improve reliability among a broad range of power and signal applications and can now be sourced through TTI. The design assures connector performance with three locking capabilities including terminal position assurance, integrated latching mechanism and connector position assurance.

CUI Inc have launched their smallest ac-dc power supplies yet with the release of the PBK ultra-compact SIP series. Available in 1 W, 3 W, and 5 W families, the modules measure as small as 1.38 x 0.43 x 0.94 in. (35 x 11 x 24 mm), occupying less pcb real-estate than other conventional ac-dc power supplies, allowing designers to fully maximise space where on-board ac-dc power conversion is required.

ams AG has invested over €25m to create dedicated 3D IC production capacity at its wafer fabrication plant near Graz, Austria. The investment provides for the installation of new 3D IC equipment in clean room space available at the plant, situated at the company’s headquarters.

NXP Semiconductors has unveiled a complete new family of self-calibrating capacitive touch and proximity switches designed for harsh environments. The PCF8883 and PCF8885, along with the automotive-grade PCA8885 and PCA8886, are intended to enable robust sensing despite dust, moisture, grease and other types of contamination building up on the touch area, and offer high immunity to sudden temperature changes and to electromagnetic interference.

Bluetooth Smart innovator CSR has unveiled the world’s thinnest wireless touch interface in order to demonstrate the revolutionary potential of the technology for computing interfaces. The flexible device, which is less than 0.5 mm thick, is able to turn any area into a touch surface. Combining CSR’s low-power wireless technology with the latest in printable, flexible electronics and touch screen sensing, the device can be used to extend the touch interface of tablets and smartphones.