Features

STMicroelectronics upgrades conventional camera module architecture

A new innovative IC from STMicroelectronics has been designed that will enable compact digital cameras and cameraphones to meet the growing demands for increased power from the built-in flash unit while supporting more sophisticated user controls. The STCF04, is an integrated camera flash and torch controller that raises the maximum power of an LED flash module from a few Watts, which are more typical of today’s designs, to over 40 Watts, producing the brightness equivalent to an outdoor security floodlight.

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Movidius and Toshiba collaborate on 3D system solution for smartphones

Movidius, the mobile multimedia processor company, is partnering with Toshiba Electronics Europe to develop a complete 3D system solution for the smartphone market. The company’s MA1178 device has been combined with Toshiba’s 8 Megapixel EDOF (extended depth of field) cameras to enable 3D camera module manufacturers to deliver a distinct 3D imaging solution, that will be suitable for top of the range smartphones. EDOF cameras offer a number of advantages over traditional autofocus in terms of 3D synchronisation.

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MStar licenses ARM Mali GPU technology for smart-TV applications

MStar, a semiconductor supplier for display and digital home solutions, has licensed ARM Mali Graphics Processing Unit (GPU) technology for use in smart-TV applications. Already highly integrated into existing MStar products and deployed in the latest mainstream consumer electronics devices, the Mali-400 MP GPU will help to strengthen MStar"s smart-TV solutions. This includes support for high performance applications, such as the latest 3D user interfaces and gaming experiences.

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EasySYNC releases new family of rugged, adapter modules

EasySYNC Ltd, a specialist in USB communications and instrumentation systems, has introduced a new family of rugged, adapter modules. These modules have been designed to present a simple method for allowing legacy serial devices to interface with modern interconnect ports based on Universal Serial Interface (USB) technology.

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Intersil’s single and dual channel 14-bit ADCs said to be industry’s fastest

Intersil Corporation has introduced what it claims to be the industry’s fastest, lowest power single and dual channel 14-bit analogue-to-digital converters with JESD204B serial outputs. These serial output ADCs provide single channel sampling rates of up to 500 Megasamples/second and dual channel rates up to 250 Megasamples/second.

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Baseplate-cooled AC-DC power supplies from TDK-Lambda deliver 1000W

TDK-Lambda UK has introduced the CPFE1000F range of baseplate-cooled AC-DC power supplies for applications requiring 1000W bulk power. As with the existing lower power CPFE500F modules, the CPFE1000F is conduction cooled and therefore does not require a fan thus satisfying applications that need high power but cannot use fans or where the unit is sealed in an enclosure.

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New wideband I/Q demodulator improves receiver performance

Linear Technology’s new LTC5585 is an ultrawide bandwidth direct conversion I/Q demodulator which offers enhanced linearity performance (IIP3 = 25.7dBm and IIP2 = 60dBm at 1.95GHz). The device is capable of baseband output demodulation bandwidth of over 530MHz, which can support new generation wideband LTE multimode receivers’ and digital pre-distortion (DPD) receivers’ bandwidth requirements.

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Texas Instruments unveils advanced signal conditioners

Texas Instruments (TI) has introduced 10 signal conditioners designed to drive high-speed interface standards such as 10G/40G/100G Ethernet, 10G-KR (802.3ap), InfiniBand, Fibre Channel and CPRI. The new integrated circuits (ICs) join a comprehensive family of repeaters and retimers that combat signal impairments caused by insertion loss, jitter, reflections and crosstalk in high-speed enterprise servers, routers and switches.

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Next-generation of mini-flat transistor couplers from Toshiba

Toshiba Electronics Europe (TEE) has announced two new ultra-miniature photocouplers that have been designed to provide ‘drop-in’ replacement for some of the company’s most popular coupler parts while reducing board mounting profiles by over 17%.

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