Features

Lattice Semiconductor has launched a scalable, in-system upgradable, star topology power management architecture that can be used across a wide range of circuit boards requiring more than 12 power supply rails.  Lattice has also simultaneously made available two new application notes for its Platform Manager devices that will enable customers to quickly adopt the new architecture. 

Extending its portfolio of embedded Wi-Fi modules, Alpha Micro Components has introduced the Gainspan GS1011MIPS and GS1011MExS, two of the smallest modules on the market. At 19.4 mm x 28.7 mm, these modules will provide a significant reduction in footprint and offer an easy to integrate, compact and cost-effective solution for power critical cost sensitive wireless applications, according to the company.

CISSOID, a leading supplier of high-temperature and high reliability semiconductor solutions, has unveiled a new version of HADES, its turnkey isolated gate driver reference design, which has been tailored to support SEMISOUTH silicon carbide (SiC), normally-off power JFETs (SJEP120R100).

Avnet Embedded, an EMEA distributor of Option embedded solutions, has introduced the wireless industry’s first 3G PCie module with an integrated SIM card holder and micro SD card holder and optional WiFi. 

Swissbit has extended its CFast portfolio with a new processor technology, which has enabled it to design SLC storage cards with a capacity of up to 64GB. The F-200 series includes an SATA II (Spec 2.6) interface and is compatible with ATA7 and ATA8.

The TC7SB3157CFU from Toshiba Electronics Europe (TEE) is a 1-bit SPDT (single pole double throw) bus switch for high-speed digital applications requiring a 5V interface. With low I/O terminal capacitance (CI/O) and on resistance (RON) the new device is suitable for switching high-speed data traffic.

STMicroelectronics has integrated remote control technology from RealVNC, the original inventor and provider of VNC, onto its automotive-grade infotainment application processors. The integration will help to simplify and speed up the roll out of mobile-to-vehicle connectivity solutions, supporting the seamless and safe interplay of phones, apps and cars.

NXP Semiconductors has launched the SSL2109 – a high-efficiency buck controller for high-power, non-dimmable LED lighting applications using non-isolated topologies. Designed for use with an external power switch, the SSL2109 LED driver IC provides a single design platform for 100V, 120V and 230V mains input voltages and power ranges up to 25 W.

Sierra Wireless has announced a new addition to its AirPrime Q Series of embedded wireless modules. The AirPrime Q2698 adds support for 3G HSPA+ on five frequency bands to the AirPrime Q Series, along with support for 2G GSM/GPRS/EDGE on four frequency bands, making it compatible with networks worldwide and suitable for global deployments.

Melexis has launched its next generation IC family for sensor-less and sensor based BLDC motor control in automotive applications. The new IC family consists of 4 base members; the MLX81205, MLX81207, MLX81210 and MLX81215. Each is available with a variety of memory configurations and in different package options.