Features

NXP unleashes multi-stage variable gain LNAs for base stations

NXP Semiconductors has introduced the BGU706x series of multi-stage base station LNAs with variable gain and featuring what the company says is the industry’s lowest noise figure of 0.9 dB for a receive chain in silicon. The architecture of the LNA is based on the integration of a very low-noise LNA with a bypass function followed by an analogue-controlled variable gain amplifier (VGA). These new low-noise amplifiers deliver high linearity, while saving up to 80 percent in component count.

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Harwin adds extra-small bore Datamate connector range

Harwin has added an extra-small bore crimp contact to its Datamate family of high reliability 2mm pitch connectors, designed for use in challenging applications. Adding to Datamate"s existing wire sizes of 22awg (large bore) & 24-28 awg small bore, the new additions to the range feature an extra-small bore, female crimp contact, suitable for use with 28, 30 and 32 AWG wire.

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Low profile PCB relays now available with AC coils

Finder’s low profile relay range has now been extended for use with AC supply voltages. The new 24VAC and 230VAC versions of the 41 Series are suitable where the use of a DC supply voltage would either prove unsuitable or would incur additional cost.

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AVX’s resistive product series optimised for power handling and low VSWR

AVX Corporation has developed a series of thin and thick film resistive products optimised for maximum power handling and low voltage standing wave ratio (VSWR).  The series, which includes high-power resistors, terminations, and attenuators, features power handling from 4W to 800W, and is available in a variety of sizes and termination styles, including flange, leaded, and surface mount.

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Cyntech lands Zippy switch deal

Cyntech Components, a specialist supplier of electro-mechanical components and power supplies, has won an agreement to distribute switches from the Taiwanese company, Zippy.

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New chipset provides for enhanced Interoperability, 3D and Interactive capabilities

Texas Instruments (TI) has unveiled a new family of image processing chips that have been designed for front projectors, which will enable broader standardisation of 3D and interactive technologies. Projectors with the new chipset design, which will be incorporated in shipping units starting late summer 2012, will be able to seamlessly display content from common 3D-formats supported by HDMI 1.4, from virtually any mobile device including tablets, smart phones, laptops and Blu-ray players.

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